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niobium-silicide

VD0804 Niobium Silicide Evaporation Materials, NbSi2

Catalog No.VD0804
MaterialNiobium Silicide (NbSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier specializing in high-purity niobium silicide evaporation materials, alongside a diverse range of other evaporation materials. We provide our products in both powder and granule formats, with the option for custom forms tailored to your specific needs.

MSDS File

Niobium Silicide Evaporation Materials: Overview

Niobium silicide evaporation material, with the chemical formula NbSi2, is a high-performance silicide ceramic used in various deposition processes. This material is crucial for achieving superior quality in deposited films. TFM produces niobium silicide evaporation materials with exceptional purity levels, reaching up to 99.9995%. Our rigorous quality assurance procedures ensure that each product meets the highest standards of reliability.

Applications of Niobium Silicide Evaporation Materials

Niobium silicide evaporation materials are integral to several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily used in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our niobium silicide evaporation materials are carefully tagged and labeled to facilitate easy identification and quality control. We prioritize the protection of these materials during storage and transportation to prevent any potential damage.

Contact TFM

As a leading supplier of high-purity niobium silicide evaporation materials, TFM offers various forms including tablets, granules, rods, and wires. We also provide customized shapes and quantities upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on other materials, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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