Product Overview
Platinum Ruthenium Sputtering Target (Pt/Ru) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.
Material and Deposition Characteristics
Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | ≥ 99.95% (metals basis typical) | Ensures stable electrical and catalytic performance |
| Composition Ratio | Custom (e.g., Pt 80–90%, Ru 10–20%) | Controls catalytic activity and CO tolerance |
| Density | ≥ 99% of theoretical | Minimizes arcing and improves sputtering stability |
| Diameter | 25 – 200 mm (custom available) | Matches sputtering system holders |
| Thickness | 3 – 6 mm (typical) | Influences target lifetime |
| Bonding | Copper backing plate (optional) | Enhances thermal conductivity |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Platinum Ruthenium | Enhanced CO tolerance & catalytic efficiency | Fuel cell anodes |
| Pure Platinum | Excellent corrosion resistance | Microelectronic contacts |
| Ruthenium | High hardness & oxidation resistance | Barrier layers |
| Iridium | Extreme corrosion resistance | Harsh chemical environments |
| Question | Answer |
|---|---|
| Can the Pt/Ru composition be customized? | Yes, atomic or weight ratios can be precisely tailored for catalytic or electronic requirements. |
| Is the target compatible with DC sputtering? | Yes, due to its metallic conductivity, DC magnetron sputtering is typically used. |
| Are backing plates recommended? | For larger diameters or high-power applications, copper backing plates improve thermal stability. |
| What industries use Pt/Ru most frequently? | Fuel cell manufacturing, electrochemistry research, semiconductor fabrication, and sensor technology. |
| How is the target packaged? | Vacuum-sealed with protective cushioning and export-grade cartons or wooden crates for secure transport. |
Typical Thin-Film Applications
- Platinum Ruthenium alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
- Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
- Research and production programs that require customized alloy ratios and repeatable sputtering behavior
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
Can the composition of a Platinum Ruthenium sputtering target be customized?
Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.
Will an alloy target always produce a film with the same composition?
Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.
Is a Platinum Ruthenium alloy target compatible with DC magnetron sputtering?
Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.
Why is alloy homogeneity important in a Platinum Ruthenium target?
A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.
Can a Platinum Ruthenium target be supplied bonded?
Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.
What should I include in an RFQ for Platinum Ruthenium?
Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.
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