Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
potassium-tantalate-sputtering-target-removebg-preview-1

ST0981 Potassium Tantalate Sputtering Target, KTaO3

Chemical FormulaKTaO3
Catalog No.ST0981
CAS Number12030-91-0
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM is committed to providing Potassium-Tantalate sputtering targets with a focus on exceptional quality and cost-effectiveness. Our competitive pricing ensures that these targets are an ideal choice for a diverse range of high-tech applications, delivering superior quality while maintaining affordability.

MSDS File

ST0981 Potassium Tantalate Sputtering Target, KTaO3Potassium Tantalate Sputtering Target Description

Potassium-Tantalate sputtering targets are essential in thin film deposition technology, serving critical roles across various fields. They are extensively used in creating optical coatings, preparing electronic devices, and advancing research in electronics and optics.

Potassium tantalate (KTaO3) is a key ferroelectric material, notable for its ferroelectric, optical, and electro-optic properties, as well as piezoelectricity. Its applications span electronics, optics, optoelectronics, and acoustic devices, making it a versatile material in both practical and research contexts.

Related Product: Potassium Niobate Sputtering Target, Potassium Tantalate Crystal Substrates

Potassium Tantalate Sputtering Target Specifications

Compound FormulaKTaO3
CAS No.12030-91-0
AppearanceWhite Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Potassium Tantalate Sputtering Target Handling Notes

Indium bonding is recommended for Potassium-Tantalate sputtering targets because of their characteristics that can pose challenges during sputtering, such as brittleness and low thermal conductivity. The low thermal conductivity and susceptibility to thermal shock of this material make indium bonding an effective solution to enhance its stability and performance during the sputtering process.

Potassium Tantalate Sputtering Target Application

Potassium-Tantalate sputtering targets are widely utilized in thin film deposition technology, demonstrating remarkable versatility and impact across multiple applications. In optical coatings, these targets are crucial for creating coatings that improve light manipulation and transmission, thereby advancing optical technologies. Their use in electronic device preparation is equally significant, ensuring the production of high-performance components essential for modern electronics. Additionally, Potassium-Tantalate sputtering targets are fundamental in various research fields within electronics and optics, supporting the development and exploration of new technologies.

Potassium Tantalate Sputtering Target Packaging

Our Potassium-Tantalate sputtering targets are meticulously managed during storage and transportation to ensure they retain their quality and arrive in optimal condition.

Get Contact

TFM’s Potassium-Tantalate sputtering targets come in a range of forms, purities, and sizes. We focus on producing high-purity physical vapor deposition (PVD) materials with the highest density and smallest average grain sizes, ideal for use in semiconductor, chemical vapor deposition (CVD), and PVD applications in display and optical technologies.

Reviews

There are no reviews yet.

Be the first to review “ST0981 Potassium Tantalate Sputtering Target, KTaO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top