Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
praseodymium-calcium-manganate-sputtering-target-pr0-7ca0-3mno3-removebg-preview-1

ST0181 Praseodymium Calcium Manganate Sputtering Target, Pr0.7Ca0.3MnO3

Chemical Formula: Pr0.7Ca0.3MnO3
Catalog Number: ST0181
CAS Number:
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Praseodymium Calcium Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Praseodymium Calcium Manganate Sputtering Target Description

The Praseodymium Calcium Manganate Sputtering Target from TFM is an oxide sputtering material composed of praseodymium (Pr), calcium (Ca), manganese (Mn), and oxygen (O). This material is commonly used in various advanced applications, including thin-film deposition, due to its unique properties.

Praseodymium

Praseodymium, symbolized as “Pr,” is a chemical element named after the Greek words ‘prasios didymos,’ meaning green twin. It was first mentioned in 1885 and observed by A. von Welsbach. Praseodymium has an atomic number of 59 and is situated in Period 6, Group 3 of the periodic table, within the f-block. Its relative atomic mass is 140.90765(2) Dalton, with the number in brackets indicating the uncertainty. Praseodymium is commonly used in various alloys, ceramics, and in the production of strong permanent magnets.

Related Product: Praseodymium Sputtering Target

CalciumCalcium, symbolized as “Ca,” is a chemical element named after the Latin word ‘calx,’ meaning lime. It was first mentioned and observed in 1808 by H. Davy, who also accomplished its isolation. Calcium has an atomic number of 20 and is located in Period 4, Group 2 of the periodic table, within the s-block. Its relative atomic mass is 40.078(4) Dalton, with the number in brackets indicating the measurement uncertainty. Calcium is an essential element in biology, playing a key role in the structural integrity of bones and teeth, as well as in cellular signaling processes.

Related Product: Calcium Sputtering Target

manganeseManganese, symbolized as “Mn,” is a chemical element named either from the Latin ‘magnes,’ meaning magnet, or from ‘magnesia nigra,’ referring to black magnesium oxide. It was first mentioned in 1770 and observed by O. Bergman, with the isolation later achieved and announced by G. Gahn. Manganese has an atomic number of 25 and is located in Period 4, Group 7 of the periodic table, within the d-block. Its relative atomic mass is 54.938045(5) Dalton, with the number in brackets indicating the measurement uncertainty. Manganese is essential in steel production, improving its strength, hardness, and durability, and is also important in various chemical and biological processes.

Related Product: Manganese Sputtering Target

OxygenOxygen, denoted by the chemical symbol “O,” is a chemical element named from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed in 1771 by W. Scheele, who also successfully isolated it. Oxygen has an atomic number of 8 and is positioned in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is crucial for life on Earth, as it is a key component of the air we breathe and is involved in various biological and chemical processes, including combustion and respiration.

Praseodymium Calcium Manganate Sputtering Target Bonding Service

Specialized bonding services for  Praseodymium Calcium Manganate Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Praseodymium Calcium Manganate Sputtering Target Packaging

Our Praseodymium Calcium Manganate sputtering targets are meticulously tagged and labeled externally to ensure accurate identification and uphold stringent quality control standards. We take great care in handling and packaging these targets to prevent any damage during storage and transportation, thereby preserving the integrity and performance of the material.

Get Contact

We offer high-quality Praseodymium Calcium Manganate sputtering targets in a range of forms, purities, sizes, and prices to meet diverse application needs. Our expertise lies in producing high-purity thin film coating materials with the highest possible density and the smallest average grain sizes, ensuring superior performance in various deposition processes. Please contact us for current pricing information and to inquire about sputtering targets and other deposition materials that may not be listed in our standard inventory.

Reviews

There are no reviews yet.

Be the first to review “ST0181 Praseodymium Calcium Manganate Sputtering Target, Pr0.7Ca0.3MnO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top