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ST0036 Praseodymium Sputtering Target, Pr

Chemical Formula: Pr
Catalog Number: ST0036
CAS Number: 7440-10-0
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Praseodymium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Praseodymium Sputtering Target Description

The praseodymium sputtering target is made from high-purity praseodymium metal. Praseodymium, symbolized as “Pr,” is named after the Greek words ‘prasios didymos,’ meaning green twin. Discovered by A. von Welsbach in 1885, praseodymium has an atomic number of 59 and is found in Period 6 and Group 3 of the periodic table, specifically in the f-block. Its relative atomic mass is 140.90765 Daltons, with the value in parentheses indicating the measurement uncertainty.

Praseodymium Sputtering Target Specification

Material TypePraseodymium
SymbolPr
Color/AppearanceSilvery White
Melting Point935 °C
Density935 °C
Thermal Conductivity1.25 W/cm·K
Electrical Resistivity0.7 µΩ-m
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Praseodymium Sputtering Target Application

The praseodymium sputtering target is utilized in various applications such as thin film deposition, decoration, semiconductor manufacturing, displays, LED and photovoltaic devices, and functional coatings. It is also widely used in the optical information storage industry, glass coating for automotive and architectural glass, and optical communications.

Other Applications of Praseodymium:

  • High-Intensity Permanent Magnets: Ideal for electric generators, motors in wind turbines, and hybrid cars.
  • Special Yellow Glass Goggles: Used by glass welders and blowers.
  • Alloying Agent: Used in manufacturing high-strength metals.
  • High-Intensity Carbon Arc Lights: Utilized in floodlighting and the film industry.

Handling Notes

  1. No Bonding Service Available: Currently, bonding services are not offered for the praseodymium sputtering target.
  2. High Chemical Activity: Praseodymium sputtering targets are highly reactive when exposed to the environment. Therefore, oil packaging and a clean procedure are essential to prevent chemical reactions.

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TFM offers Praseodymium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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Pr 3N ø50.8*3.18mm, Pr 3N ø50.8*3mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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