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ST0038 Rhodium Sputtering Target, Rh

Rhodium Sputtering Target (Rh)

Introduction

Rhodium (Rh) Sputtering Targets are premium materials widely used in thin film deposition for semiconductor, optical, and decorative applications. Known for their exceptional hardness, reflectivity, and corrosion resistance, Rhodium targets provide high-quality coatings that are both functional and aesthetically appealing. Due to its scarcity and value as a precious metal, rhodium is often used in high-performance and specialized applications.

Detailed Description

Our Rhodium Sputtering Targets are manufactured from high-purity rhodium (≥99.9%) using advanced powder metallurgy and vacuum melting techniques. The targets exhibit uniform density, fine grain structure, and excellent thermal stability, ensuring consistent sputtering performance.

  • Purity: 99.9% (3N) and above

  • Form: Circular, rectangular, or custom-made targets

  • Backing Options: Indium bonding, elastomer bonding, or copper plate bonding for thermal and mechanical stability

  • Appearance: Bright, metallic silver surface with high reflectivity

Rhodium’s unique physical and chemical properties—such as high melting point (1,964 °C) and excellent oxidation resistance—make it a preferred choice for demanding thin film processes.

Applications

Rhodium sputtering targets are extensively used in:

  • Semiconductors – thin film transistors, interconnects, and barrier layers

  • Optical coatings – mirrors, beam splitters, and reflective devices

  • Decorative coatings – jewelry, watches, and luxury accessories

  • Protective layers – corrosion- and wear-resistant coatings

  • Energy & catalysis research – hydrogen evolution, electrochemical studies, and catalytic coatings

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% (3N)Ensures low contamination and superior film quality
Diameter25 – 300 mm (customizable)Fits various sputtering systems
Thickness3 – 6 mmAffects sputtering efficiency
BondingIndium, Elastomer, CopperEnhances stability and thermal transfer
Density12.41 g/ccProvides excellent sputtering uniformity
Melting Point1,964 °CSupports high-temperature processes

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Rhodium (Rh)High reflectivity & corrosion resistanceOptical & decorative coatings
Platinum (Pt)Strong catalytic activityCatalysis, semiconductors
Palladium (Pd)Hydrogen absorption capabilityEnergy & sensors
Gold (Au)Excellent conductivity & stabilityElectronics, optics

Frequently Asked Questions (FAQ)

QuestionAnswer
Can I order customized rhodium targets?Yes, we offer custom dimensions, purity levels, and bonding options.
What is the typical lead time?Standard delivery is 2–3 weeks, depending on size and order volume.
How are rhodium targets packaged?Each target is vacuum-sealed and shipped in protective, export-safe packaging.
Which industries rely on rhodium targets?Semiconductor, optics, luxury decorative, aerospace, and energy research.

Conclusion

Rhodium Sputtering Targets deliver superior thin film performance with unmatched reflectivity, hardness, and corrosion resistance. Their high purity and custom processing make them an excellent choice for cutting-edge semiconductor, optical, and decorative applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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