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ST0185 Silicon Dioxide Sputtering Target, SiO2

Chemical Formula: SiO2
Catalog Number: ST0185
CAS Number: 7631-86-9
Purity: 99.9%, 99.95%, 99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Silicon Dioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Silicon Dioxide Sputtering Target

Introduction

Silicon Dioxide (SiO₂) Sputtering Target is one of the most widely used oxide materials for thin film deposition. Known for its excellent dielectric strength, high optical transparency, and chemical stability, SiO₂ targets are indispensable in semiconductor fabrication, optical coatings, displays, and photovoltaic devices. Thin films derived from SiO₂ provide superior insulation, passivation, and protective properties, making them essential in both industrial production and advanced R&D.

Detailed Description

Silicon Dioxide sputtering targets are produced from high-purity fused silica or quartz powders using hot pressing or vacuum sintering techniques. This ensures dense, homogeneous targets with stable sputtering performance and minimal contamination.

  • Chemical Formula: SiO₂

  • Purity: Available in 99.9% – 99.999% (3N–5N) to meet semiconductor-grade requirements.

  • Appearance: Transparent to translucent solid, depending on fabrication process.

  • Forms & Dimensions: Circular targets (25–300 mm), rectangular plates, and custom sizes. Thickness typically ranges from 3–6 mm.

  • Bonding Options: Indium or elastomer bonding to copper or titanium backing plates for improved heat dissipation.

  • Properties: High dielectric constant, low thermal expansion, and excellent optical transmission from UV to IR.

Applications

SiO₂ sputtering targets are widely used in:

  • Semiconductors – Gate dielectrics, passivation layers, and insulating films.

  • Optical Coatings – Anti-reflective layers, beam splitters, and protective coatings.

  • Displays (TFT-LCD, OLED) – Transparent insulating and protective layers.

  • Photovoltaics – Encapsulation, passivation, and optical coatings in solar cells.

  • R&D – Thin film studies in electronics, photonics, and nanotechnology.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999%High purity ensures semiconductor-grade films
Diameter25 – 300 mm (custom)Compatible with most sputtering systems
Thickness3 – 6 mmAffects sputtering stability and film thickness
BondingCopper / Titanium backingImproves thermal management and target durability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Silicon Dioxide (SiO₂)Excellent dielectric & optical claritySemiconductors, optics
Silicon Nitride (Si₃N₄)High hardness, good diffusion barrierMicroelectronics, coatings
Hafnium Oxide (HfO₂)High-k dielectric, thermal stabilityAdvanced gate dielectrics

FAQ

QuestionAnswer
Can SiO₂ targets be customized?Yes, purity, size, and bonding options are fully customizable.
What is the delivery time?Standard lead time is 2–3 weeks, depending on order size and specifications.
Are SiO₂ targets fragile?Yes, being a ceramic material, they should be handled carefully.
How is it packaged?Vacuum-sealed with protective foam in export-safe cartons or wooden crates.
Which industries use SiO₂ targets most?Semiconductors, optics, display technologies, solar energy, and R&D.

Silicon Dioxide Sputtering Target Bonding Service

Specialized bonding services for Silicon Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Silicon Dioxide Sputtering Targets are vacuum-sealed to prevent contamination and moisture absorption. Each target is carefully cushioned with protective foam and shipped in export-grade cartons or wooden crates, with clear labeling for traceability.

Conclusion

Silicon Dioxide Sputtering Targets provide outstanding dielectric, optical, and chemical stability, making them a key material in thin film deposition for semiconductors, optics, and energy devices. With high purity, customizable specifications, and reliable performance, SiO₂ targets are the preferred choice for both industrial-scale production and advanced research.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Order Now

SiO2 Target 4N 150*50*3mm Indium Bonded 3mm Cu B/Plate, SiO2 Target 4N 150*50*6mm Indium Bonded 3mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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