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VD0754 Silicon Nitride Evaporation Materials, Si3N4

Catalog No.VD0754
MaterialSilicon Nitride (Si3N4)
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a leading manufacturer and supplier of high-purity Silicon Nitride evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms. Custom forms can also be arranged to meet specific requirements upon request.

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Silicon Nitride Evaporation Materials Overview

Silicon Nitride evaporation materials from TFM are advanced nitride ceramic compounds with the chemical formula Si3N4. Renowned for their high purity, TFM’s Si3N4 materials are critical in ensuring superior film quality during deposition processes. With purity levels reaching up to 99.9995%, these materials are meticulously produced and quality-tested to guarantee their reliability and performance.

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Silicon Nitride Evaporation Materials Specifications

Material TypeSilicon Nitride
SymbolSi3N4
Appearance/ColorGray Solid
Melting Point1,900 °C (decomposes)
Density3.17 g/cm3
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

Applications of Silicon Nitride Evaporation Materials

Silicon Nitride evaporation materials find diverse applications, including:

  • Deposition Processes: Essential in semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD).
  • Optical Uses: Ideal for wear-resistant coatings, decorative applications, and display technologies.

Packaging and Handling

TFM ensures that all Silicon Nitride evaporation materials are carefully tagged and labeled for easy identification and quality assurance. We prioritize secure packaging to prevent any damage during storage and transportation.

Contact Us

TFM is a premier provider of high-purity Silicon Nitride evaporation materials, available in various forms including tablets, granules, rods, and wires. We also offer custom solutions tailored to your specific needs. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to request materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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