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ST0046 Silver Sputtering Target, Ag

Chemical Formula: Ag
Catalog Number: ST0046
CAS Number: 7440-22-4
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Silver sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Silver Sputtering Target Description

SilverSilver sputtering targets share the same properties as their source material. Silver is a soft, white, and lustrous transition metal that boasts the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. The metal is found in the Earth’s crust in several forms: in its pure, free elemental form known as “native silver,” as an alloy with gold and other metals, and in minerals such as argentite and chlorargyrite. Most silver is produced as a byproduct during the refining of copper, gold, lead, and zinc.

Silver Sputtering Target Specifications

Material Type Silver
Symbol Ag
Atomic Number 47
Color/Appearance Silver, Metallic
Melting Point 962 °C
Theoretical Density 10.5 g/cc
Sputter DC
Type of Bond Indium, Elastomer
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Silver Sputtering Target Application

High-performance silver sputtering materials are utilized in a variety of thin film coating applications, including decorative coatings, antibiotic coatings for medical devices, and large area coatings for fuel cells. Sterling silver, a popular form of silver, is widely used in jewelry, silverware, and electrical contacts. Silver also plays a crucial role in photography and is essential in the production of solder and brazing alloys, as well as electrical contacts.

Silver Sputtering Target Target Bonding Services

Specialized bonding services for Silver Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Silver Sputtering Target Handling Notes

Our reclaim service is available for silver sputtering targets. We aim to reduce your material costs by recycling precious metals and spent targets, helping you achieve both economic and environmental benefits.

Silver Sputtering Target Packing

Our Silver Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Silver Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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