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Stainless Steel Ball Valves (Manual)

Stainless Steel Ball Valves Overview

These stainless steel ball valves are designed for high- and coarse-vacuum service, ensuring reliable performance in demanding environments.

Key Features

  • Leak Rate: Maintains a leak rate of less than 1 x 10⁻⁹ standard cc/sec He.
  • Durable Sealing: Equipped with PTFE seats and fluorocarbon seals, both of which are easily replaceable without the need for demounting.
  • Unrestricted Bore: When open, the valves provide an unrestricted bore, facilitating high gas conductance, making them ideal for low-cost sample entry locks.
  • Efficient Closure: When closed, the main bore is evacuated through a side vent hole, ensuring optimal vacuum integrity.

Specifications Table

ManufacturerTFM
PressureTorr
Min: 1.000 x 10-8 Torr
Max: 760 Torrmbar
Min: 1.330 x 10-8 mbar
Max: 1013 mbar
RatesHelium Leak Rate
1.010 x 10-9 mbar*L/s
1.000 x 10-9 sccs
7.600 x 10-10 Torr*L/s
TemperatureBakeable
150 ºC
302 ºFIntermittent Bake
200 ºC
392 ºF
Shaft Seal
Material		Shaft with Fluorocarbon (FKM) Seal
Actuator
Type		Manual
Valve Body
Material		316L SS
Valve Seal
Material		Teflon

Ordering Table

Drawing Flange Size Ball Size (inches) Note Part Number
Tooltip KF16 (1.18" OD) 0.56 Limited availability and specially priced. BVB0075MVQF
Tooltip KF25 (1.57" OD) 0.81 Limited availability and specially priced. BVC0100MVQF
Tooltip KF40 (2.16" OD) 1.25 Limited availability and specially priced. BVD0150MVQF
Tooltip KF50 (2.95" OD) 1.87 Limited availability and specially priced. BVF0200MVQF

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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