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ST0251 Strontium Fluoride Sputtering Target, SrF2

Chemical Formula: SrF2
Catalog Number: ST0251
CAS Number: 7783-48-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Strontium Fluoride Sputtering Target Description

The Strontium Fluoride Sputtering Target is a fluoride ceramic sputtering target made from strontium and fluorine. It is specifically designed for use in various thin film deposition processes across different industries.

Strontium

Strontium, symbolized as “Sr,” is a chemical element named after Strontian, a small town in Scotland. It was first identified in 1787 by W. Cruikshank, with its isolation later achieved and announced by H. Davy. Strontium has an atomic number of 38 and is located in Period 5 and Group 2 of the periodic table, classified within the s-block. The relative atomic mass of strontium is approximately 87.62(1) Dalton, with the number in parentheses indicating the uncertainty of this measurement.

Fluorine

Fluorine, also referred to as fluorin, is a chemical element with the symbol “F,” derived from the Latin word ‘fluere,’ meaning to flow. It was first identified by A.-M. Ampère in 1810, and its isolation was later successfully achieved by H. Moissan. Fluorine is element number 9 on the periodic table, located in Period 2 and Group 17, belonging to the p-block. Its relative atomic mass is 18.9984032(5) Dalton, with the number in parentheses indicating the uncertainty of this measurement.

Strontium Fluoride Sputtering Target Application

The Strontium Fluoride Sputtering Target is widely used in various industries for thin film deposition. It plays a crucial role in decoration, semiconductor manufacturing, displays, LEDs, and photovoltaic devices. Additionally, it is utilized in creating functional coatings and is important in the optical information storage industry. This target is also applied in the glass coating industry, including automotive and architectural glass, as well as in optical communication technologies.

Strontium Fluoride Sputtering Target Packing

Our Strontium Fluoride Sputter Targets are clearly tagged and labeled externally for easy identification and stringent quality control. We take great care to protect these targets from any potential damage during storage and transportation, ensuring they arrive in excellent condition.

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TFM offers Strontium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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