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strontium-oxide

ST0421 Strontium Oxide Sputtering Target, SrO

Chemical Formula: SrO
Catalog Number: ST0421
CAS Number:1314-11-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Strontium Oxide Sputtering Target Description

The strontium oxide sputtering target is a colorless target composed of high-purity strontium oxide. Strontium oxide, also known as strontia (SrO), is formed when strontium reacts with oxygen, resulting in a colorless cubic crystal. When strontium burns in air, it produces a mixture of strontium oxide and strontium nitride. Additionally, strontium oxide can be formed through the decomposition of strontium carbonate (SrCO3). It is recognized as a strongly basic oxide, making it useful in various applications.

Related Product: Strontium Sputtering Target

Strontium Oxide Sputtering Target Specification

Material TypeStrontium Oxide
SymbolSrO
Color/AppearanceColorless Cubic Crystals
Melting Point2,531° C (4,588° F)
Boiling Point3200 °C (5792 °F)
Density4.7 g/cm3
Type of BondIndium, Elastomer
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Strontium Oxide Sputtering Target Bonding Service

Specialized bonding services for Strontium Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

 

Strontium Sputtering Target Application

The strontium oxide sputtering materials are used for CD-ROM, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Strontium oxide can be used in glass, optics and ceramic industries, such as the manufacture of television picture tube glass. It is also an active ingredient in paint dryers. It can also be used to prepare pure strontium by heating with aluminum under vacuum.

Strontium Sputtering Target Packaging

Our strontium oxide sputter coater target is carefully packaged in a plastic vacuum bag to prevent damage during storage and transportation, ensuring the product remains in its original condition. Additionally, the Certificate of Analysis (COA) for the raw material is included with the product to verify its quality and specifications.

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TFM offers Strontium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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