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ST0992 Strontium Vanadate Sputtering Target, SrVO3

Chemical FormulaSrVO3
Catalog No.ST0992
CAS Number12345-86-8
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM is renowned for its extensive expertise in supplying Strontium Vanadate Sputtering Targets with exceptional purity at competitive prices. With years of experience in materials science, TFM ensures the delivery of high-quality targets that meet the rigorous standards required for nanotechnology and thin-film deposition applications.

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Strontium Vanadate Sputtering Target Description

Strontium Vanadate Sputtering Target stands out for its exceptional combination of properties:

  • High Purity: Ensures consistent and defect-free film deposition, essential for demanding applications.
  • High Density: Provides exceptional physical strength and stability, suitable for rigorous industrial conditions.
  • High Sputtering Rate: Ensures efficient film deposition.
  • Low Resistivity: Facilitates efficient electron transport.
  • Excellent Chemical Stability: Resists harsh environments and corrosion.
  • High-Temperature Oxidation Resistance: Withstands extreme conditions without degrading.

These attributes make Strontium Vanadate Sputtering Targets vital in fields such as electronics, communications, energy production, and environmental protection.

Related Product: Strontium Sputtering Target, Strontium Oxide Sputtering Target

Strontium Vanadate Sputtering Target Specifications

Compound FormulaSrVO3
Molecular Weight285.497
AppearanceBlack Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Strontium Vanadate Sputtering Target Handling Notes

Indium bonding is recommended for Strontium Vanadate Sputtering Targets due to:

  • Brittleness: Strontium Vanadate’s inherent brittleness can complicate the sputtering process.
  • Low Thermal Conductivity: This material’s low thermal conductivity makes it prone to uneven heating and thermal stress.
  • Thermal Shock Susceptibility: Strontium Vanadate can be sensitive to sudden temperature changes, which can lead to damage or performance issues.

Indium bonding helps mitigate these issues, ensuring a stable and effective sputtering process.

Strontium Vanadate Sputtering Target Application

Strontium Vanadate Sputtering Targets have several notable applications:

  • Electronics and Information Industry: Used to prepare thin film materials for integrated circuits, information storage, liquid crystal displays, laser memory, and electronic control devices. They are effective for creating conductive films and barrier films in these applications.
  • Wear-Resistant and High-Temperature Corrosion-Resistant Fields: Due to their excellent physical and chemical properties, they are ideal for producing wear-resistant and corrosion-resistant coatings. These coatings are used in manufacturing engine parts, thermal energy equipment, and other high-stress environments.
  • Optical Field: Employed in preparing optical films such as transmittance enhancement films, reflection films, and filters. These films are used in optical instruments, photographic equipment, and lighting equipment to improve performance and functionality.

Strontium Vanadate Sputtering Target Packaging

Our Strontium Vanadate Sputtering Targets are meticulously managed throughout both storage and transportation processes to ensure they arrive in pristine condition, maintaining the highest quality standards.

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TFM’s Strontium Vanadate Sputtering Targets come in a range of forms, purities, and sizes. We focus on delivering high-purity physical vapor deposition (PVD) materials that offer exceptional density and minimal average grain sizes. These targets are ideal for use in semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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