ST0216 Tantalum Nitride Sputtering Target, TaN

Chemical Formula: TaN
Catalog Number: ST0216
CAS Number: 12033-62-4
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Tantalum Nitride Sputtering Target Description

Tantalum Nitride sputtering target from TFM is a ceramic sputtering material with the chemical formula TaN. This material is commonly used in thin film deposition processes for various industrial applications due to its excellent properties, including high hardness, thermal stability, and chemical resistance.

niobium

Tantalum is a chemical element with the symbol “Ta,” named after King Tantalus from Greek mythology. It was first identified in 1802 by the Swedish chemist Anders Gustaf Ekeberg. Tantalum has an atomic number of 73, placing it in Period 6 and Group 5 of the periodic table, within the d-block. The element has a relative atomic mass of 180.94788(2) Dalton, where the number in brackets indicates the measurement uncertainty. Tantalum is known for its high melting point and resistance to corrosion, making it valuable in various industrial applications, including electronics and aerospace engineering.

Related Product: Tantalum Sputtering Target

NitrogenNitrogen is a chemical element with the symbol “N,” originating from the Greek words ‘nitron’ and ‘genes,’ meaning “nitre-forming.” It was first identified in 1772 by Daniel Rutherford. Nitrogen has an atomic number of 7 and is located in Period 2 and Group 15 of the periodic table, within the p-block. Its relative atomic mass is 14.0067(2) Dalton, with the number in brackets indicating the uncertainty in measurement. Nitrogen is a crucial element in the atmosphere and is essential for life, playing a key role in the structure of proteins and nucleic acids.

Tantalum Nitride Sputtering Target Specification

Material TypeTantalum Nitride
SymbolTaN
Color/AppearanceSolid
Melting Point3090 °C
Density14.3 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Tantalum Nitride Sputtering Target Application

The tantalum nitride sputtering target is utilized in various applications, including thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also employed for functional coatings in the optical information storage industry, as well as for glass coating applications such as car and architectural glass. Additionally, tantalum nitride is used in optical communication systems. Its versatile properties make it valuable across these industries, particularly for enhancing durability, functionality, and performance in coatings and electronic components.

Tantalum Nitride Sputtering Target Packaging

Our tantalum nitride sputtering target is meticulously tagged and labeled externally to ensure accurate identification and stringent quality control. We take great care in handling and packaging these targets to prevent any potential damage during storage or transportation, thereby preserving the product’s integrity and quality.

Get Contact

TFM offers Tantalum Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0216 Tantalum Nitride Sputtering Target, TaN”

Your email address will not be published. Required fields are marked *

Related Products

FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

Shopping Cart
Scroll to Top