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ST0524 Tantalum Silicide Sputtering Target, Ta5Si3

Chemical Formula: Ta5Si3
Catalog Number: ST0524
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Silicide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tantalum Silicide Sputtering Target Description

Our Platinum Silicide Sputtering Targets are tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, preserving the quality of our products.

Related Product: Tantalum Sputtering Target.

Tantalum Silicide Sputtering Target Specifications

MaterialTantalum Silicide (TaSi2)
Purity99.9% and above
ShapeDiscs, Plates, Custom Shapes, or as per your specifications
SizeDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
Sputtering Target Bonding OptionsIndium, Elastomer, or Customized
Surface RoughnessAs machined or as required
Melting PointApproximately 2,780°C
Available DocumentsCertificate of Analysis (COA), Material Safety Data Sheet (MSDS), and Customized Documents

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Tantalum Silicide Sputtering Target Applications

  • Semiconductor Fabrication: Used in the production of semiconductor devices to create precise thin film coatings.
  • Optical Coatings: Essential for optical components, lenses, and mirrors in the optics industry.
  • Electronics: Key for electronic circuitry and microelectronics.
  • Scientific Research: Utilized for thin film deposition in research and development.

Packing

Our Tantalum Silicide Sputtering Targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage during storage and transportation.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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