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ST0048 Tantalum Sputtering Target, Ta

Chemical Formula:Ta
Catalog Number: ST0048
CAS Number: 7440-25-7
Purity: 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tantalum Sputtering Target Description

Tantalum sputtering targets are primarily used in integrated circuits and Thin Film Transistor Liquid Crystal Displays (TFT-LCDs). TFM specializes in producing high-purity sputtering targets with the highest possible density and the smallest average grain sizes. Tantalum is a rare, hard, blue-gray, lustrous transition metal that is highly corrosion-resistant and chemically inert. These properties make it an essential material for laboratory equipment, serving as a substitute for platinum, and as a minor component in refractory metal alloys.

Tantalum Sputtering Target Specification

Material Type Tantalum
Symbol Ta
Color/Appearance Gray Blue, Metallic
Thermal Conductivity 57 W/m.K
Melting Point 3,017°C
Coefficient of Thermal Expansion 6.3 x 10-6/K
Sputter DC
Type of Bond Indium, Elastomer
Comments Forms good films
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Tantalum Sputtering Target Application

High-performance tantalum sputtering materials are used in various thin film coating applications, including CD-ROMs, decoration, flat panel displays, functional coatings, optical information storage, and glass coatings for car glass and architectural glass. These materials are also used in optical communications and other industries.

Capacitors

About half of the tantalum consumed annually is used in the electronics industry, primarily as powder and wire for capacitors. Tantalum capacitors are favored in space-sensitive, high-end applications such as telecommunications, data storage, and implantable medical devices.

Semiconductors

In the physical vapor deposition (PVD) process, tantalum sputtering targets are used to form thin film diffusion barriers on semiconductor substrates, protecting copper interconnects. Tantalum sputtering targets are also used in magnetic storage media, inkjet printer heads, and flat panel displays.

Engine Turbine Blades

Tantalum’s high melting point and corrosion resistance make it ideal for alloying applications. It is used in nickel-based superalloys for turbine blades in aircraft engines and land-based gas turbines.

Chemical Processing Equipment

Tantalum’s resistance to corrosion and high temperatures makes it suitable for constructing liners in vessels, piping, valves, and heat exchangers used in the chemical and pharmaceutical industries.

Tantalum Sputtering Target Target Bonding

Specialized bonding services for Tantalum Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Tantalum Sputtering Target Packaging

Our Tantalum Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Tantalum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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