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Tantalum Titanium Sputtering Target

ST0509 Tantalum Titanium Sputtering Target, Ta/Ti

Chemical Formula: Ta/Ti
Catalog Number: ST0509
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Tantalum Titanium Sputtering Target Description

Discover the exceptional qualities of Tantalum Titanium sputtering targets and their wide-ranging applications. This page highlights the unique properties and potential uses of Tantalum Titanium in thin film deposition across various industries.

Tantalum: Enduring Corrosion Resistance

Tantalum is a rare, lustrous transition metal known for its exceptional corrosion resistance. As part of the refractory metals group, it is frequently used in alloys and serves as a substitute for platinum in laboratory equipment. Tantalum sputtering targets are widely utilized in the production of integrated circuits and Thin Film Transistor Liquid Crystal Displays (TFT-LCDs).

Titanium: Versatility in Excellence

Titanium is a lustrous, silver-colored transition metal renowned for its low density, high strength, and resistance to corrosion in harsh environments such as seawater, aqua regia, and chlorine. Titanium sputtering targets are crucial in applications including CD-ROM production, decorative finishes, flat panel displays, functional coatings, optical information storage, glass coatings, and optical communication.

Related Products: Tantalum Sputtering Target, Titanium Sputtering Target.

Tantalum Titanium Sputtering Target Specifications

SpecificationDetails
Material TypeTantalum Titanium
SymbolTa/Ti
Color/AppearanceMetallic solid in various forms including powder, sputtering target, foil, bar, plate
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″, Thick: 0.125″, 0.250″. Custom shapes and sizes available on inquiry.
PackingTargets are tagged and labeled externally for identification and quality control. Careful handling during storage and transportation.

Tantalum Titanium Sputtering Target Applications

  1. Thin Film Deposition: Tantalum Titanium sputtering targets are essential for creating thin films used in integrated circuits, TFT-LCDs, and other advanced technologies.
  2. Coating Excellence: These targets enhance the quality of CD-ROMs, decorative finishes, and functional coatings for optical storage and communication.
  3. Innovations Unleashed: Tantalum Titanium targets support progress in semiconductor technologies, CVD, PVD, and optical applications.

Tantalum Titanium Sputtering Target Advantages

  • Unyielding Corrosion Resistance: Tantalum Titanium’s exceptional corrosion resistance boosts the durability and effectiveness of thin film depositions.
  • Versatile Applications: Its diverse applications, from advanced displays to optical communication, highlight the adaptability of Tantalum Titanium sputtering targets.
  • Innovative Potential: Utilizing Tantalum Titanium targets drives advancements in various high-tech industries.

Explore the potential of Tantalum Titanium Sputtering Targets and harness their exceptional properties for groundbreaking applications. Contact us today to discover customized solutions that drive your innovation forward.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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