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ST1004 Terbium Iron Cobalt Sputtering Target, Tb-Fe-Co

Chemical FormulaTb-Fe-Co
Catalog No.ST1004
CAS Number
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

With deep expertise in materials science, TFM presents Terbium Iron Cobalt Sputtering Targets, known for their high purity. TFM is dedicated to excellence in materials engineering, offering customized solutions and competitive pricing for nanotechnology and thin-film deposition applications.

Introduction

Terbium Iron Cobalt (Tb-Fe-Co) Sputtering Target is a rare-earth transition metal alloy specifically engineered for magneto-optical and magnetic thin film applications. As a classic amorphous magnetic alloy system, Tb-Fe-Co exhibits strong perpendicular magnetic anisotropy, high coercivity, and excellent magneto-optical Kerr effect (MOKE) response.

Tb-Fe-Co sputtering targets are widely used in magnetic storage media, spintronic devices, and advanced research on magnetic thin films. Their composition can be precisely tuned to achieve targeted magnetic switching behavior, thermal stability, and optical response.


Detailed Description

Tb-Fe-Co is a ternary alloy combining:

  • Terbium (Tb) – Provides strong magnetic anisotropy and magneto-optical activity

  • Iron (Fe) – Contributes high magnetic moment

  • Cobalt (Co) – Enhances Curie temperature and improves thermal stability

This alloy system is well known for forming amorphous thin films when deposited by magnetron sputtering. The amorphous structure is particularly advantageous for uniform magnetic domains and predictable switching characteristics.

Typical composition ranges may vary depending on application (e.g., TbₓFeᵧCo_z with customized atomic ratios). Adjusting the Tb content directly influences coercivity and compensation temperature, which are critical parameters for magneto-optical recording and spintronic research.

Tb-Fe-Co sputtering targets are produced through vacuum melting and controlled casting processes to ensure homogeneous composition. Advanced hot pressing or HIP consolidation methods are often applied to achieve high density (≥ 98–99% theoretical density), minimizing arcing and particle generation during sputtering.

Available configurations include:

  • Planar circular targets (commonly 1″–8″ diameter or larger custom sizes)

  • Rectangular targets for inline coating systems

  • Bonded to copper backing plates for improved thermal management

The alloy’s magnetic performance depends strongly on composition uniformity and impurity control. Oxygen and carbon levels are tightly regulated to preserve film purity and magnetic consistency.


Applications

Terbium Iron Cobalt sputtering targets are primarily used in:

  • Magneto-Optical Recording Media – Perpendicular magnetic recording layers

  • Spintronic Devices – Magnetic tunnel junctions and spin-based electronics

  • Magnetic Sensors – Thin film magnetic detection systems

  • Research & Development – Studies of compensation temperature and domain dynamics

  • Advanced Memory Technologies – Emerging magnetic storage platforms

Tb-Fe-Co thin films are especially valued for their fast magnetic switching and stable perpendicular anisotropy.


Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99% (metals basis)Reduces magnetic impurities and improves film stability
CompositionCustom atomic ratio (e.g., Tb 20–30%)Controls coercivity and compensation temperature
Density≥ 98–99% of theoreticalMinimizes arcing and ensures stable sputtering
Diameter25 – 200 mm (custom available)Matches sputtering system holders
Thickness3 – 6 mm (typical)Influences target lifetime
BondingCopper backing plate (optional)Improves heat dissipation and structural stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Tb-Fe-CoStrong perpendicular anisotropy & MOKE responseMagneto-optical storage
Gd-Fe-CoTunable compensation temperatureMagnetic switching research
Co-PtHigh magnetic anisotropyPerpendicular recording
Fe-CoHigh saturation magnetizationMagnetic cores & sensors

Compared to Gd-Fe-Co, Tb-Fe-Co typically offers stronger magneto-optical effects, making it more suitable for optical magnetic recording applications.


FAQ

QuestionAnswer
Can the Tb-Fe-Co composition be customized?Yes, the Tb, Fe, and Co atomic ratios can be precisely tailored to achieve desired magnetic properties.
Is the target suitable for DC or RF sputtering?Typically DC magnetron sputtering is used due to the metallic nature of the alloy.
Does the target require backing plate bonding?For higher power or larger diameters, copper backing plates are recommended to enhance thermal management.
What is the typical film structure?Tb-Fe-Co films are generally amorphous when sputtered under standard conditions.
How is the product packaged?Vacuum-sealed with protective cushioning and export-grade cartons or wooden crates.

Packaging

Our Terbium Iron Cobalt Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.


Conclusion

Terbium Iron Cobalt (Tb-Fe-Co) Sputtering Targets provide a high-performance solution for magneto-optical and advanced magnetic thin film applications. With tunable composition, high density, and reliable magnetic characteristics, Tb-Fe-Co alloys support cutting-edge research and industrial magnetic technologies.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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