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ST0254 Tin Fluoride Sputtering Target, SnF2

Chemical Formula: SnF2
Catalog Number: ST0254
CAS Number: 7783-47-3
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tin Fluoride Sputtering Target Target

The Tin Fluoride Sputtering Target is a type of fluoride ceramic sputtering target composed of tin and fluorine. This target is specifically designed for use in various sputtering processes, including thin film deposition and other applications.

TinTin, also known by its Latin name “stannum,” is a chemical element with the symbol “Sn.” The name tin comes from the Anglo-Saxon word ‘tin,’ and ‘stannum’ means hard in Latin. Tin has been used since approximately 3500 BC. It is element number 50 on the periodic table, located in Period 5 and Group 14, within the p-block. The relative atomic mass of tin is 118.710(7) Dalton, with the number in parentheses indicating the uncertainty in this measurement.

Related Product: Tin Sputtering Target

FluorineFluorine, sometimes referred to as fluorin, is a chemical element with the symbol “F.” Its name is derived from the Latin word ‘fluere,’ meaning to flow. First mentioned in 1810 by A.-M. Ampère, its isolation was later accomplished and announced by H. Moissan. Fluorine has an atomic number of 9 and is located in Period 2 and Group 17 of the periodic table, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty of this value.

Tin Fluoride Sputtering Target Application

The Tin Fluoride Sputtering Target is extensively used in various industrial applications. It is particularly valuable for thin film deposition processes and is employed in decorative applications, semiconductor production, displays, LEDs, and photovoltaic devices. Additionally, it is used for functional coatings in the optical information storage industry. This target also plays a role in the glass coating industry, including applications for automotive and architectural glass, as well as in optical communication technologies.

Tin Fluoride Sputtering Target Packing

Our Tin Fluoride Sputter Targets are clearly tagged and labeled on the exterior for easy identification and strict quality control. We take great care to protect these targets from any potential damage during storage or transportation, ensuring they remain in excellent condition upon arrival.

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TFM offers Tin Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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