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tiniv-oxide-evaporation-materials

VD0733 Tin(IV) Oxide Evaporation Materials, SnO2

Catalog No.VD0733
MaterialTin(IV) Oxide (SnO2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

At TFM, we specialize in the manufacture and supply of high-purity tin(IV) oxide evaporation materials, alongside a diverse range of other evaporation products. Our tin(IV) oxide materials are available in both powder and granule forms, and we also offer custom formulations to meet specific needs upon request.

MSDS File
Tin(IV) Oxide Evaporation Materials Overview

Tin(IV) oxide evaporation material, with the chemical formula SnO₂, is essential for high-precision deposition processes. TFM is dedicated to providing high-purity SnO₂ materials, which are critical for ensuring the quality of deposited films. Our products are manufactured to achieve purities of up to 99.9995%, supported by rigorous quality assurance to guarantee product reliability.

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Specifications of Tin(IV) Oxide Evaporation Materials

Material TypeTin(IV) Oxide
SymbolSnO2
Color/AppearanceWhite or Gray, Crystalline Solid
Melting Point1,630 °C
Theoretical Density 6.95 g/cc
Purity99.9% ~ 99.99%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications of Tin(IV) Oxide Evaporation Materials

Tin(IV) oxide evaporation materials are utilized in various applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear protection, decorative coatings, and display technologies.

Packaging Information

Our tin(IV) oxide evaporation pellets are meticulously packaged in plastic vacuum bags to prevent damage during storage and transport, ensuring the product’s quality is maintained. Each shipment includes a Certificate of Analysis (COA) to verify the material’s quality.

Contact Us

TFM is committed to delivering high-purity tin(IV) oxide evaporation materials tailored for semiconductor, CVD, and PVD applications, as well as optical uses. Our expert teams in engineering, manufacturing, and analysis work together to produce top-tier evaporation materials. For more information or to make an inquiry, contact us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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