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ST1003 Tin Silver Sputtering Target, Sn-Ag

Chemical FormulaSn-Ag
Catalog No.ST1003
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Leveraging extensive materials science expertise, TFM introduces Tin Silver Sputtering Targets, renowned for their outstanding purity. Our dedication involves providing customized solutions and competitive pricing to meet the precise demands of nanotechnology and thin-film deposition, reflecting TFM’s commitment to excellence in materials engineering.

 

MSDS File

Tin Silver Sputtering Target Description

Tin Silver Sputtering Target is a material used in the sputtering deposition process. Sputtering is a widely used technique in thin film deposition, where atoms or ions are ejected from a solid target material and deposited onto a substrate to form a thin film.

Tin Silver Sputtering Target is often used in electronic applications, particularly in the manufacturing of solder alloys. The addition of silver to tin improves the mechanical properties, such as strength and ductility, of the solder, making it suitable for joining electronic components.

Related Product: Tin Zinc Sputtering Target, Tin Sputtering Target

Tin Silver Sputtering Target Specifications

Compound FormulaSn-Ag
Molecular Weight226.5
AppearanceSilver Metallic Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Tin Silver Sputtering Target Handling Notes

Indium bonding is recommended for the Tin Silver Sputtering Target due to its characteristics, such as brittleness and low thermal conductivity, which are not conducive to sputtering. This material’s low thermal conductivity and susceptibility to thermal shock make indium bonding a suitable choice to ensure reliable performance during the sputtering process.

Tin Silver Sputtering Target Application

  • Electronic Manufacturing: Tin Silver Sputtering Targets are crucial for producing high-performance electronic devices, thanks to their excellent electrical conductivity.
  • Semiconductor Manufacturing: These targets are significant in semiconductor manufacturing, aiding in the creation of efficient and reliable semiconductor components.
  • Coating Production: They play a key role in thin-film deposition processes, ensuring the production of precise and uniform coatings for various industrial and research applications.
  • Nanotechnology Applications: The targets demonstrate versatility and adaptability, making them valuable in advancing nanotechnology and cutting-edge technologies.

Tin Silver Sputtering Target Packaging

Our Tin Silver Sputtering Target is meticulously handled during storage and transportation to ensure the quality of our products is maintained in their original condition.

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TFM’s Tin Silver Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.

 

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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