Tin Thulium Sputtering Target
Introduction
The Tin Thulium Sputtering Target (Sn-Tm) is a specialized alloy material designed for use in advanced thin-film deposition processes such as magnetron sputtering and physical vapor deposition (PVD). Combining the ductility and conductivity of tin with the unique magnetic and optical properties of thulium, this target is ideal for producing functional films in electronics, optics, and sensor technologies.
Detailed Description
The Tin Thulium Sputtering Target is typically composed of 96.5 at% Sn and 3.5 at% Tm, though compositions can be customized to meet specific application requirements. The target exhibits high chemical uniformity, excellent adhesion, and low gas content, ensuring stable sputtering performance.
Thulium’s inclusion enhances the target’s film properties, offering improved magnetic responsiveness, infrared absorption, and electrical characteristics. These films are widely used in multilayer coatings where precise control over conductivity and magneto-optical behavior is essential.
Each target is fabricated using high-purity raw materials (up to 99.99%) through vacuum melting and hot pressing or cold isostatic pressing (CIP) followed by sintering. The result is a dense, fine-grained structure with exceptional mechanical stability and consistent erosion during deposition.
Applications
Semiconductor fabrication: thin films for microelectronic devices and interconnect layers
Optoelectronic components: coatings for photonic sensors and laser mirrors
Magneto-optical films: data storage and optical isolators
Protective coatings: wear-resistant and corrosion-resistant surface layers
Research & development: novel alloy film synthesis and material property studies
Technical Parameters
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | 99.9% – 99.99% | Ensures consistent sputtering and film quality |
| Composition | Sn 96.5% / Tm 3.5% (at%) | Balanced alloy for conductivity and magneto-optical response |
| Density | ~7.3 g/cm³ | Indicates compact microstructure |
| Diameter | 25 – 150 mm (custom) | Compatible with different sputtering systems |
| Thickness | 3 – 6 mm | Affects sputtering rate and target life |
| Bonding | Indium / Elastomer / Copper backing | Improves thermal management and target stability |
Comparison with Related Materials
| Material | Key Advantage | Typical Application |
|---|---|---|
| Tin Thulium (Sn-Tm) | Enhanced magnetic & optical control | Advanced sensors, optical coatings |
| Tin (Sn) | Excellent conductivity | Semiconductor solder films |
| Tin Indium (Sn-In) | Transparent and conductive films | ITO alternative coatings |
FAQ
| Question | Answer |
|---|---|
| Can the Sn-Tm target be customized? | Yes, composition, size, and bonding type can be adjusted based on customer requirements. |
| What is the standard purity level? | Typically 99.9% or higher, depending on application needs. |
| Is bonding required? | Bonding with indium or copper is recommended for large-diameter targets to improve heat transfer. |
| How are the targets packaged? | Vacuum-sealed with anti-static and moisture-proof materials, shipped in wooden crates. |
| Which deposition methods is it compatible with? | Suitable for DC/RF magnetron sputtering and PVD systems. |
Packaging
All Tin Thulium Sputtering Targets are meticulously vacuum-sealed, labeled, and cushioned in foam-lined, export-grade cartons or wooden boxes. Each target is handled under controlled conditions to prevent oxidation or contamination during storage and transport.
Conclusion
The Tin Thulium Sputtering Target offers a unique combination of electrical, optical, and magnetic characteristics, making it ideal for high-performance thin-film research and industrial applications. Its customizable composition and reliable sputtering behavior ensure compatibility with modern coating systems.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.
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