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Titanium Ferrite Sputtering Target

ST0473 Titanium Ferrite Sputtering Target, TiFe2O4

Chemical Formula: TiFe2O4
Catalog Number: ST0473
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Ferrite sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Ferrite Sputtering Target Description

Titanium Ferrite Sputtering Target consists of titanium, iron, and oxygen. High-purity titanium ferrite sputter targets are essential in deposition processes to achieve high-quality films. TFM specializes in producing sputtering targets with up to 99.9995% purity, utilizing stringent quality assurance processes to ensure product reliability.

Related products: Titanium Sputtering Target, Iron Sputtering Target

Titanium Ferrite Sputtering Target Specification

Material Type Titanium Ferrite
Symbol TiFe2O4
Color/Appearance Solid
Melting Point /
Density 7.35 g/cm3
Type of Bond Elastomer, Indium
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Titanium Ferrite Sputtering Target Application

Titanium Ferrite Sputtering Target is utilized for thin film deposition and serves various applications including decoration, semiconductor manufacturing, displays, LED and photovoltaic devices, functional coatings, optical information storage industries, glass coatings for car glass and architectural glass, and optical communication, among others.

Titanium Ferrite Sputtering Target Packaging

Our Titanium Ferrite Sputter Targets are meticulously handled to prevent any damage during storage and transportation, ensuring that the quality of our products is maintained in their original condition.

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TFM offers Titanium Ferrite Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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