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ST0196 Titanium Pentoxide Sputtering Target, Ti3O5

Chemical Formula: Ti3O5
Catalog Number: ST0196
CAS Number: 12065-65-5
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Pentoxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Titanium Pentoxide Sputtering Target Description

Titanium Pentoxide sputtering target, supplied by TFM, is a high-purity oxide sputtering material composed of the compound Ti3O5. This material is characterized by its unique dark blue to black appearance and is widely used in various thin film deposition processes, particularly in industries that require precise and reliable thin films for electronic and optical applications.

Related Product: Titanium Sputtering Target

Titanium Pentoxide (Ti3O5) Overview:

Origin: Titanium Pentoxide is a compound composed of titanium and oxygen. The name “titanium” is derived from the Titans of Greek mythology, symbolizing strength. The term “oxygen” comes from the Greek words ‘oxy’ and ‘genes’, meaning “acid-forming.”

Properties: Titanium Pentoxide, or Ti3O5, has a high melting point of approximately 1800°C and a density of 4.2 g/cm³. This compound is notable for its optical properties, including a wide transparency range and a high refractive index, making it ideal for use in various optical applications, such as coatings and thin films.

Titanium Pentoxide Sputtering Target Specification

Compound FormulaTi3O5
Molecular Weight223.598
AppearanceBlack blue powder
Melting Point1800 °C
Density4.2 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Titanium Pentoxide Sputtering Target Application

Optical Coatings: Titanium Pentoxide is ideal for anti-reflective (AR) coatings, beam splitters, and cold light coating filters, enhancing the performance and durability of optical systems by reducing glare and improving light transmission.

High-Resolution Devices: This material is used in coatings for glasses and other high-precision optical components, contributing to high-resolution imaging and precise light control in advanced optical devices.

Titanium Pentoxide Sputtering Target Packaging

Each Titanium Pentoxide Sputtering Target is meticulously handled and packaged to ensure its quality and purity. We employ standard packaging procedures that include vacuum sealing the target in a clean environment. This method prevents contamination and safeguards the product during transportation, ensuring that it reaches the end-user in optimal condition.

Frequently Asked Questions (FAQs)

Q1: What are the main applications of Titanium Pentoxide in coatings?

A1: Titanium Pentoxide is widely used in optical coatings such as anti-reflective (AR) coatings, beam splitters, and cold light coating filters. It is also ideal for high-reflection (HR) coatings and glasses coatings, thanks to its broad transparency range and high refractive index.

Q2: Can I order custom dimensions for Titanium Pentoxide sputtering targets?

A2: Yes, we offer Titanium Pentoxide sputtering targets in various forms and sizes. Custom dimensions can be fabricated to meet specific customer requirements.

Q3: How do you ensure the purity and quality of your sputtering targets?

A3: Our Titanium Pentoxide targets are produced under stringent quality control procedures to ensure a purity level of over 99.9%. We conduct thorough testing to verify the material’s quality, ensuring it meets the highest standards.

Q4: What kind of support does TFM offer for clients using sputtering targets?

A4: We provide extensive technical support, including detailed product data sheets and expert consultation. This helps our clients choose the right materials for their specific applications, ensuring optimal results.

Q5: What are the benefits of using high-purity Titanium Pentoxide sputtering targets?

A5: Using high-purity targets reduces the risk of contaminants in thin films, thereby improving the performance and reliability of coated components. This is particularly important in sensitive optical applications.

Q6: How is Titanium Pentoxide packaged for shipping?

A6: Titanium Pentoxide sputtering targets are vacuum-sealed in a clean environment to protect against air and moisture exposure. For bulk orders, additional protective measures are taken to ensure the product arrives in excellent condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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