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ST0117 Titanium Tungsten Sputtering Target, Ti/W

Chemical Formula: Ti/W
Catalog Number: ST0117
CAS Number: 58397-70-9
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Tungsten sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Tungsten Sputtering Target Description

The Titanium Tungsten Sputtering Target from TFM is an alloy material composed of titanium (Ti) and tungsten (W). This sputtering target combines the advantageous properties of both elements, making it ideal for various high-performance applications.

Titanium

Titanium is a Group IV transition metal renowned for its biocompatibility, which makes it one of the most important metals in biomedical applications. It is a lustrous metal with a silver color, low density, and high strength. Titanium’s resistance to corrosion in seawater, aqua regia, and chlorine further enhances its versatility. Its strong yet lightweight nature and excellent corrosion resistance make it ideal for use in ocean liner hulls, aircraft engines, and designer jewelry.

Related Product: Titanium Sputtering Target

Tungsten

Tungsten, also known as wolfram (symbol “W”), is a chemical element named after the Swedish words ‘tung sten,’ meaning heavy stone. Tungsten is a greyish-white, lustrous metal that is solid at room temperature. It holds the highest melting point and lowest vapor pressure of all metals, making it exceptionally resistant to heat. Tungsten also boasts excellent corrosion resistance and is only slightly affected by most mineral acids, further enhancing its durability in various applications.

Related Product: Tungsten Sputtering Target

Titanium Tungsten Sputtering Target Specification

Compound FormulaTi/W
AppearanceMetallic solid in various forms (plate, bar, sheet, strip, powder, foil)
Exact Mass231.90 g/mol
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Titanium Tungsten Sputtering Target Bonding Services

Specialized bonding services for Titanium Tungsten Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Titanium Tungsten Sputtering Target Application

The Titanium Tungsten Sputtering Materials are widely used for a variety of applications, including CD-ROM production, decoration, semiconductors, displays, LED and photovoltaic devices, and functional coatings. Additionally, they are utilized in the optical information storage industry, glass coating for car and architectural glass, optical communication, and other related fields.

Packing

Our metal alloy Titanium Tungsten Sputter Coater Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care to prevent any damage during storage and transportation, ensuring that our products arrive in perfect condition.

Get Contact

TFM offers Titanium Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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