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ST0520 Tungsten Diboride Sputtering Target, W2B

Chemical Formula: W2B
Catalog Number: ST0520
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Diboride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tungsten Diboride Sputtering Target Description

TungstenTungsten is a rare metal found naturally on Earth almost exclusively in chemical compounds rather than in its pure form. Identified as a new element in 1781 and first isolated as a metal in 1783, its significant ores include wolframite and scheelite.

Tungsten has the highest melting point of all elements, at 3422 °C, and the highest boiling point, at 5930 °C. Its density is 19.25 times that of water, comparable to uranium and gold, and about 1.7 times higher than lead. While polycrystalline tungsten is inherently brittle and hard, pure single-crystalline tungsten is more ductile and can be cut with a hard-steel hacksaw.

Related Product: Tungsten Sputtering Target.

Tungsten Diboride Sputtering Target Specifications

Material TypeTungsten Diboride
SymbolW2B
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Tungsten Diboride Sputtering Target Applications

Semiconductor Manufacturing: Tungsten diboride (WB₂) sputtering targets are essential in the semiconductor industry for thin-film deposition. They are crucial for creating advanced semiconductor devices like integrated circuits (ICs) and microelectromechanical systems (MEMS). The thin films produced serve as conductive layers in modern electronics.

Hard Coatings: WB₂ thin films are valued for their extreme hardness and wear resistance. They are applied as protective coatings on cutting tools, drills, and industrial equipment. These coatings improve the lifespan and performance of tools and machinery in metalworking and machining processes.

Optical Applications: Tungsten diboride coatings enhance the performance of optical lenses and mirrors. They reduce glare, increase reflectivity, and add durability to optical systems used in telescopes, cameras, and other devices.

Aerospace and Defense: WB₂ sputtering targets are used in the aerospace and defense sectors to protect critical components like turbine blades and nozzles from high temperatures, oxidation, and wear. This ensures the reliability and longevity of aerospace components.

Energy Storage: Tungsten diboride is explored for use in energy storage technologies such as lithium-ion batteries and supercapacitors. Its electrical conductivity and high-temperature stability make it a promising candidate for enhancing the performance and safety of energy storage devices, which is crucial for renewable energy systems and electric vehicles.

Packing

Our Tungsten Diboride Sputtering Targets are clearly tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, preserving the quality of our products in their original condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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