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ST0510B Tungsten Nickel Boride Sputtering Target, WNiB

Tungsten Nickel Boride (WNiB) Sputtering Target

Chemical Formula: W/Ni/B
Catalog Number: ST0510B
Purity: 99.7% – 99.999% (custom purity available)
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Nickel Boride (WNiB) sputtering targets are available in various forms, purities, sizes, and competitive pricing. Thin Film Materials (TFM) manufactures and supplies high-performance WNiB targets with precise composition control for advanced thin-film deposition applications.

MSDS File

Tungsten Nickel Boride (WNiB) Sputtering Target Description

Discover the exceptional performance of Tungsten Nickel Boride (WNiB) Sputtering Targets and their transformative applications across high-tech industries. This page showcases the remarkable synergy of Tungsten, Nickel, and Boron in advanced thin film deposition, opening new frontiers in materials science and engineering.

Tungsten: The Pinnacle of Strength

Tungsten (W), with its distinctive steel-gray appearance, stands as the metal with the highest melting point (3,422°C) in the periodic table. Renowned for its extraordinary density, hardness, and thermal stability, tungsten maintains exceptional strength even at elevated temperatures. These properties make WNiB sputtering targets indispensable for applications requiring extreme durability, including cutting tools, aerospace components, and high-temperature electronics.

Nickel Boride: The Catalyst for Excellence

The nickel boride (NiB) component introduces unique catalytic properties and enhanced wear resistance to the alloy. This combination creates a material with superior electrical conductivity and remarkable corrosion resistance, even in harsh chemical environments. The WNiB composite excels in applications demanding both mechanical robustness and functional performance.

Related Products: Tungsten Sputtering Target, Nickel Boride Sputtering Target

Tungsten Nickel Boride Sputtering Target Specifications

SpecificationDetails
Material TypeTungsten Nickel Boride
Chemical SymbolW/Ni/B
Color/AppearanceMetallic gray, solid
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″; Thick: 0.125″, 0.250″ (Custom available)
Standard Purity99.7% (Higher purities up to 99.999% on request)
PackagingIndividually tagged, vacuum-sealed with protective casing

WNiB Sputtering Target Applications

Revolutionary Thin Film Solutions:
WNiB targets enable deposition of ultra-durable coatings for cutting tools, turbine blades, and wear-resistant surfaces in industrial machinery.

Advanced Electronic Components:
Essential for creating diffusion barriers in semiconductor devices and high-performance contacts in microelectronics.

Innovative Energy Systems:
Critical in developing next-generation fuel cell components and high-efficiency energy storage systems.

Pioneering Research Applications:
Facilitating breakthroughs in nanotechnology, quantum computing, and advanced material science research.

WNiB Sputtering Target Advantages

Unmatched Performance:
The unique combination of tungsten’s strength with nickel boride’s functional properties creates thin films with exceptional durability and conductivity.

Versatile Engineering Solutions:
From industrial wear coatings to cutting-edge semiconductor applications, WNiB targets deliver superior performance across multiple sectors.

Future-Ready Technology:
This advanced material system enables innovations in sustainable energy, advanced manufacturing, and next-generation electronics.

Harness the Power of WNiB Sputtering Targets

Elevate your thin film technology with our premium Tungsten Nickel Boride targets. Our experts are ready to collaborate on customized solutions tailored to your specific requirements. Contact us today to discuss how WNiB can transform your next project.

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WNiB Target 99.7% ø3"*6mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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