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Tungsten Titanium Evaporation Materials

VD0655 Tungsten Titanium Evaporation Materials, W/Ti

Catalog No.VD0654
MaterialTungsten Titanium (W/Ti)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier manufacturer and supplier specializing in high-purity tungsten titanium evaporation materials, as well as a broad selection of other evaporation materials. We provide these materials in both powder and granule forms, and we can accommodate custom specifications upon request.

MSDS File

Tungsten Titanium Evaporation Materials

TFM offers high-purity tungsten titanium evaporation materials, an alloy comprised of tungsten (W) and titanium (Ti). These materials are essential in various deposition processes to ensure the production of high-quality films. Our tungsten titanium evaporation materials achieve a purity level of up to 99.9995%, supported by stringent quality assurance practices to ensure their reliability.

Related Products: Tungsten Evaporation Materials, Titanium Evaporation Materials

Applications of Tungsten Titanium Evaporation Materials

Tungsten titanium evaporation materials are utilized in several key applications:

  • Deposition processes including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our tungsten titanium evaporation materials are meticulously tagged and labeled for easy identification and quality control. We take special care to prevent any damage during storage and transportation.

Contact Us

As a leading manufacturer and supplier of high-purity tungsten titanium evaporation materials, TFM provides a variety of forms, including tablets, granules, rods, and wires. We also offer custom shapes and quantities upon request. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about our materials, including those not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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