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Vanadium(V) Oxide Evaporation Materials

VD0739 Vanadium(V) Oxide Evaporation Materials, V2O5

Catalog No.VD0739
MaterialVanadium Oxide (V2O5)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity vanadium(V) oxide evaporation materials, as well as a broad range of other evaporation materials. We offer these materials in powder and granule forms to suit different applications. Customized forms are also available upon request, ensuring flexibility to meet specific project requirements.

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Vanadium(V) Oxide Evaporation Materials Overview

TFM offers high-purity vanadium(V) oxide (V2O5) evaporation materials, which play an essential role in various deposition processes, ensuring superior film quality. With a chemical formula of V2O5, these materials are known for their high purity, reaching up to 99.9995%. TFM guarantees product reliability by utilizing stringent quality control processes during production.

Related Products:

Vanadium Evaporation Materials,

Vanadium(V) Oxide Evaporation Materials Specifications

Material TypeVanadium(V) oxide
SymbolV2O5
Appearance/ColorYellow solid
Melting Point681 °C (1,258 °F; 954 K)
Density3.35 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Vanadium(V) Oxide Evaporation Materials

Vanadium(V) oxide evaporation materials are used in a range of advanced applications, such as:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Used for wear protection, decorative coatings, and display technologies.

Packaging and Quality Control

TFM ensures that vanadium(V) oxide evaporation materials are securely packaged and clearly labeled to facilitate easy identification and maintain strict quality control. Extra care is taken during storage and transportation to prevent any damage to the product.

Contact and Customization

TFM is a leading supplier of high-purity vanadium(V) oxide evaporation materials, available in various forms including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. In addition, TFM provides evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing inquiries or further information on materials not listed, please contact TFM for a quote.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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