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Vanadium Titanium Evaporation Materials

VD0658 Vanadium Titanium Evaporation Materials, V/Ti

Catalog No.VD0658
MaterialVanadium Titanium (V/Ti)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a leading provider of high-purity vanadium-titanium evaporation materials, along with a broad range of other evaporation products. Our materials are available in both powder and granule forms, and we can also create customized solutions to meet your specific requirements.

MSDS File

Vanadium-Titanium Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) specializes in high-purity vanadium-titanium evaporation materials, which are essential for achieving high-quality thin-film deposits. These alloys, consisting of vanadium (V) and titanium (Ti), are produced with purity levels reaching up to 99.9995%. Our stringent quality assurance processes ensure the reliability and excellence of these materials.

Applications

Vanadium-titanium evaporation materials are used in a range of applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for wear-resistant coatings, decorative finishes, and display technologies.

Packaging

To maintain the highest standards of quality and prevent damage, our vanadium-titanium evaporation materials are carefully packaged and clearly labeled. This ensures efficient identification and quality control throughout storage and transportation.

Contact Us

Thin-Film Mat Engineering (TFM) offers vanadium-titanium evaporation materials in various forms, such as tablets, granules, rods, and wires. We also provide custom solutions tailored to specific needs. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about other materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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