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VD0659 Vanadium Tungsten Evaporation Materials, V/W

Catalog No.VD0659
MaterialVanadium Tungsten (V/W)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a top provider of high-purity vanadium-tungsten evaporation materials, as well as a diverse range of other evaporation products. Our materials come in both powder and granule forms, and we can also provide customized options to meet specific needs.

MSDS File

Vanadium-Tungsten Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity vanadium-tungsten evaporation materials, which are crucial for achieving excellent thin-film deposition quality. Composed of vanadium (V) and tungsten (W), these alloys are produced with purity levels up to 99.9995%, ensuring reliable performance in various applications. Our rigorous quality assurance processes guarantee the consistency and excellence of these materials.

Applications

Vanadium-tungsten evaporation materials are widely used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for wear-resistant coatings, decorative finishes, and display technologies.

Packaging

To ensure the highest quality and prevent damage, vanadium-tungsten evaporation materials are carefully packaged and clearly labeled. This meticulous packaging process aids in efficient identification and quality control throughout storage and transportation.

Contact Us

Thin-Film Mat Engineering (TFM) provides vanadium-tungsten evaporation materials in various forms, including tablets, granules, rods, and wires. We also offer customized solutions to meet specific requirements. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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