Weldable Tube 6-Way Crosses for UHV and Semiconductor Applications
TFM’s Weldable Tube 6-Way Crosses are purpose-built components engineered for the most demanding ultra-high vacuum (UHV) environments and semiconductor processing infrastructure. Crafted from 304 series stainless steel using advanced fabrication methods, these six-way fittings offer unparalleled cleanliness, precision, and adaptability for high-performance vacuum systems.
Each 6-way cross is fabricated using the pulled-port technique, ensuring full-penetration butt welds for enhanced mechanical integrity and leak-tight performance. Designed specifically to meet UHV standards, these crosses deliver vacuum capability down to ≥ 1×10⁻¹³ Torr, ideal for critical applications in semiconductor subfabs, pump exhaust lines, and foreline vacuum plumbing.
The defining feature of the Weldable Tube 6-Way Cross is its multi-axis symmetry, offering six tube connections in perpendicular orientations. This makes it a superior choice for vacuum network hubs or distribution nodes where multiple gas or vacuum lines must converge with minimal contamination risk.
With a temperature tolerance ranging from –200°C to +450°C, these crosses are suitable for both cryogenic and high-temperature operations. Their crevice-free weld geometry ensures that no particle traps or contamination pockets exist, which is essential for high-purity process environments.
Key Features of Weldable Tube 6-Way Crosses:
Material: 304 Stainless Steel, ideal for semiconductor-grade UHV systems.
Six-Way Configuration: Offers connection points on all three Cartesian axes, enabling efficient system layouts.
Cleanroom-Ready: Cleaned and prepared for use in ultra-high vacuum environments exceeding 1×10⁻¹³ Torr.
Fabrication: Constructed via pulled-port method with full-penetration butt welds to eliminate internal crevices.
Temperature Range: Capable of withstanding thermal conditions between –200°C to +450°C.
Custom Configurations: TFM offers tailored tube diameters, wall thicknesses, and flanged variants upon request to meet your exact design requirements.
Applications Include:
Semiconductor foreline and exhaust systems
Gas distribution manifolds in vacuum deposition tools
Research-grade UHV chamber interfaces
Cryogenic and high-temperature vacuum processing lines
Critical vacuum junction hubs for multi-directional flow
Whether you’re constructing a new semiconductor-grade vacuum manifold or upgrading existing UHV tooling, TFM’s Weldable Tube 6-Way Crosses provide the strength, cleanliness, and reliability your system demands.
For engineering drawings, dimensions, or custom fabrication inquiries, please contact TFM’s support team for expert assistance.
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