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ST0256 Ytterbium Fluoride Sputtering Target, YbF3

Chemical Formula: YbF3
Catalog Number: ST0256
CAS Number: 13760-80-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

MSDS File

Ytterbium Fluoride Sputtering Target Description

The Ytterbium Fluoride Sputtering Target is a type of fluoride ceramic sputtering target composed of the elements ytterbium and fluorine. It is designed for use in various sputtering processes, including thin film deposition and other industrial applications.

YtterbiumYtterbium, symbolized as “Yb,” is a chemical element named after the village of Ytterby in Sweden. It was first identified in 1878 by J.C.G. de Marignac, with its isolation later achieved and announced by G. Urbain. Ytterbium has an atomic number of 70 and is situated in Period 6 and Group 3 of the periodic table, within the f-block. The relative atomic mass of ytterbium is approximately 173.04(3) Dalton, with the number in parentheses indicating the uncertainty of this measurement.

Related Product: Ytterbium Sputtering Target

FluorineFluorine, also known as fluorin, is a chemical element with the symbol “F.” Its name comes from the Latin word ‘fluere,’ meaning to flow. The element was first mentioned in 1810 by A.-M. Ampère, with its isolation later achieved and announced by H. Moissan. Fluorine has an atomic number of 9 and is located in Period 2 and Group 17 of the periodic table, within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty of this measurement.

Ytterbium Fluoride Sputtering Target Application

The ytterbium fluoride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Ytterbium Fluoride Sputtering Target Packing

Our ytterbium fluoride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

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SAM’s ytterbium fluoride sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for the current prices of sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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