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Ytterbium Oxide Sputtering Target

ST0201 Ytterbium Oxide Sputtering Target, Yb2O3

Chemical Formula: Yb2O3
Catalog Number: ST0201
CAS Number: 1314-37-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Ytterbium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Ytterbium Oxide Sputtering Target Description

Ytterbium oxide sputtering targets from TFM are composed of the compound Yb2O3, an oxide material that includes ytterbium and oxygen. This material is utilized in various thin film deposition processes, serving applications in electronics, optics, and other advanced technology fields.

YtterbiumYtterbium is a chemical element that originated from Ytterby, Sweden. It was first mentioned in 1878 and observed by J.C.G. de Marignac. The isolation was later accomplished and announced by G. Urbain. “Yb” is the canonical chemical symbol of ytterbium. Its atomic number in the periodic table of elements is 70 with a location at Period 6 and Group 3, belonging to the f-block. The relative atomic mass of ytterbium is 173.04(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Ytterbium Sputtering Target

Oxygen, represented by the chemical symbol “O,” is a fundamental element in the periodic table with an atomic number of 8. It is located in Period 2 and Group 16, within the p-block. The name “oxygen” is derived from the Greek words ‘oxy’ and ‘genes’, meaning acid-forming. It was first identified in 1771 by the chemist W. Scheele, who also managed to isolate the element, a discovery that he announced subsequently. The relative atomic mass of oxygen is 15.9994, with the figure in brackets indicating the measurement uncertainty.

Ytterbium Oxide Sputtering Target Specification

Compound Formula Yb2O3
Molecular Weight 394.08
Appearance White
Melting Point 2,355° C
Density 9200 kg/m3
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Ytterbium Oxide Sputtering Target Packaging

Our ytterbium oxide sputtering target is meticulously tagged and labeled externally to facilitate easy identification and ensure stringent quality control. We take exceptional care in handling and packaging to prevent any potential damage during storage or transportation, ensuring that the product maintains its integrity and arrives in optimal condition.

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TFM offers Ytterbium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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