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ST0922 Yttrium Iron Garnet PLD Target, Y3Fe5O12, YIG

Chemical FormulaY3Fe5O12
Catalog No.ST0922
CAS Number12063-56-8
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Yttrium Iron Garnet (YIG) PLD sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Yttrium Iron Garnet PLD Target Description

Yttrium Iron Garnet (YIG) PLD Target is a specialized material used in the pulsed laser deposition (PLD) process, a widely employed technique for producing thin films in various applications, including electronics, magnetics, and optics.

YIG is prized for its unique magnetic and optical properties, which make it essential in the development of advanced devices. During the PLD process, a high-energy laser beam is directed at the YIG target in a vacuum chamber, causing the material to vaporize and form a plasma plume. The vaporized particles then deposit onto a substrate, creating a thin film that retains the distinctive characteristics of YIG. This precise deposition method allows for the production of thin films with tailored properties for specialized applications.

Related Product: Yttrium Oxide Sputtering Target

Yttrium Iron Garnet PLD Target Specifications

Compound FormulaY3Fe5O12
Molecular Weight737.94
AppearanceGreen target
Melting PointN/A
Density (g/cm3)5.11
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Yttrium Iron Garnet PLD Target Handling Notes

Indium bonding is recommended for Yttrium Iron Garnet (YIG) PLD Targets due to certain characteristics of the material that make it less suitable for direct sputtering. YIG exhibits low thermal conductivity and is susceptible to thermal shock, which can lead to cracking or other damage during the sputtering process. Indium bonding provides a more stable interface, helping to manage heat distribution and reduce the risk of thermal shock, ensuring the integrity and performance of the YIG target during deposition.

Yttrium Iron Garnet PLD Target Application

Yttrium Iron Garnet (YIG) PLD Target is widely used in a range of applications in electronics, magnetics, and optics due to its unique magnetic and optical properties. It is a critical material in the production of thin films for devices such as microwave components, optical isolators, and magnetic sensors.

Yttrium Iron Garnet PLD Target Packaging

Our Yttrium Iron Garnet (YIG) PLD Targets are meticulously handled during storage and transportation to ensure the preservation of their original quality.

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TFM offers Yttrium Iron Garnet (YIG) PLD Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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