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ST0057 Yttrium Sputtering Target, Y

Chemical Formula: Y
Catalog Number: ST0057
CAS Number: 7440-65-5
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Yttrium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Yttrium Sputtering Target Description

The yttrium sputtering target shares properties with its source material. Yttrium is a chemical element that originated in Ytterby, Sweden. It was first mentioned in 1794 and observed by J. Gadolin, with its isolation later accomplished and announced by G. Mosander. Represented by the chemical symbol “Y,” yttrium has an atomic number of 39, located in Period 5 and Group 3 of the periodic table, belonging to the d-block. The relative atomic mass of yttrium is 88.90585 Daltons, with the number in brackets indicating the measurement uncertainty. The yttrium sputtering target has a silvery-metallic color and is often classified as a “rare-earth sputtering target.”

Yttrium Sputtering Target Specification

Atomic Number39
Density4.472 g·cm3
Color/AppearanceSilvery White, Metallic
Thermal Conductivity17.2 W/m.K
Melting Point1526 °C, 2779 °F, 1799 K
Boiling Point3336 °C, 6037 °F, 3609 K
Coefficient of Thermal Expansion10.6 x 10-6/K
Z Ratio0.835
SputterRF, DC
Type of BondIndium, Elastomer

Yttrium Sputtering Target Application

Standard yttrium sputtering materials are used for various thin-film coating applications, including CD-ROMs, decoration, flat panel displays, functional coatings, and other optical information storage industries. They are also utilized in the glass coating industry for car glass and architectural glass, as well as in optical communications. Additionally, yttrium sputtering targets can be used for the physical vapor deposition of thin films of yttria-stabilized zirconia layers for intermediate-temperature solid oxide fuel cells (IT-SOFC).

Yttrium Sputtering Target Bonding Service

Specialized bonding services for Yttrium  Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Yttrium Sputtering Target Packaging

TFM’s yttrium sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Our products are carefully packaged in plastic vacuum bags to prevent damage during storage and transportation, preserving the quality of our products in their original condition. Additionally, the Certificate of Analysis (COA) for the raw material is included with the product.

Get Contact

TFM offers Yttrium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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