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Zinc Aluminum Evaporation Materials

VD0660 Zinc Aluminum Evaporation Materials, Zn/Al

Catalog No.VD0660
MaterialZinc Aluminum (Zn/Al)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a leading supplier of high-purity zinc-aluminum evaporation materials, along with a diverse range of other evaporation products. Our materials are available in both powder and granule forms, and we also provide custom solutions to meet your specific needs.

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Zinc Aluminum Evaporation Materials Overview

Zinc aluminum evaporation materials, produced by TFM, are specialized alloys combining zinc and aluminum designed for high-precision deposition processes. These materials are pivotal in achieving top-quality thin films due to their high purity levels. TFM excels in delivering evaporation materials with purity up to 99.9995%, thanks to rigorous quality assurance methods that ensure consistent product reliability.

Related Products: Zinc Evaporation Materials, Aluminum Evaporation Materials

Applications of Zinc Aluminum Evaporation Materials

Zinc aluminum evaporation materials are utilized in several key areas, including:

  • Deposition Processes: Essential in semiconductor fabrication, chemical vapor deposition (CVD), and physical vapor deposition (PVD) for creating high-quality thin films.
  • Optical Applications: Employed in protective coatings, decorative finishes, and display technologies to enhance durability and appearance.

Packaging and Handling

Our zinc aluminum evaporation materials are meticulously packaged with clear labeling for easy identification and quality control. We prioritize protection during storage and transit to prevent any potential damage.

Contact Us

TFM stands out as a premier provider of high-purity zinc aluminum evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires. Custom sizes and configurations are available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For the latest prices or inquiries about products not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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