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ST0219 Zinc Nitride Sputtering Target, Zn3N2

Chemical Formula: Zn3N2
Catalog Number: ST0219
CAS Number: 1313-49-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zinc Nitride Sputtering Target Description

ZincZinc is a chemical element with the symbol “Zn,” which traces its name back to the German word “zinc,” potentially derived from the Persian word “sing,” meaning stone. This element has been in use since before 1000 BC, with early discoveries credited to Indian metallurgists. Zinc is located in Period 4 and Group 12 of the periodic table and belongs to the d-block. It has an atomic number of 30 and a relative atomic mass of 65.409(4) Dalton, where the number in brackets indicates the measurement uncertainty.

Related Product: Zinc Sputtering Target

NitrogenNitrogen is a chemical element symbolized by “N,” originating from the Greek words “nitron” and “genes,” meaning nitre-forming. It was first identified in 1772 by Daniel Rutherford, who also successfully isolated it. Nitrogen has an atomic number of 7 and is located in Period 2 and Group 15 of the periodic table, which places it in the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, with the number in brackets indicating the uncertainty in this measurement.

Zinc Nitride Sputtering Target Specification

Material TypeZinc Nitride
SymbolZn3N2
Color/AppearanceGray Solid
Melting Point700 °C (decomposes)
Density6.2 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Zinc Nitride Sputtering Target Application

The zinc nitride sputtering target is widely utilized in various applications, including thin film deposition, decoration, semiconductors, displays, LED, and photovoltaic devices. It also plays a significant role in creating functional coatings and is used in optical information storage industries. Additionally, it is employed in the glass coating industry, such as for car glass and architectural glass, as well as in optical communication technologies.

Zinc Nitride Sputtering Target Packaging

Our zinc nitride sputtering target is meticulously tagged and labeled externally to ensure efficient identification and quality control. We take extensive precautions to prevent any damage during storage and transportation, thereby preserving the integrity and quality of the product.

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TFM offers Zinc Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

 

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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