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zinc-oxide

VD0742 Zinc Oxide Evaporation Materials, ZnO

Catalog No.VD0742
MaterialZinc Oxide(ZnO)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier producer and distributor of high-purity zinc oxide evaporation materials, among a diverse range of evaporation products. Our offerings include both powder and granule forms, with the flexibility to provide customized options tailored to your specific needs.

MSDS File
Zinc Oxide Evaporation Materials Overview

Our zinc oxide evaporation materials, with the chemical formula ZnO, are vital for high-quality deposition processes. TFM excels in producing zinc oxide with outstanding purity levels, reaching up to 99.9995%, ensuring top performance in film deposition applications.

Specifications

Material TypeZinc Oxide
SymbolZnO
Appearance/ColorWhite solid
Melting Point1,974 °C (3,585 °F; 2,247 K) (decomposes
Density5.606 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Zinc oxide evaporation materials are utilized in:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging

Our zinc oxide materials are meticulously tagged and labeled to ensure efficient identification and quality control. We prioritize secure packaging to prevent any damage during storage and transportation.

Contact Us

TFM offers zinc oxide evaporation materials in various forms, including tablets, granules, rods, and wires. Custom forms and quantities are available upon request. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and more information, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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