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Zinc Tin Evaporation Materials

VD0662 Zinc Tin Evaporation Materials, Zn/Sn

Catalog No.VD0662
MaterialZinc Tin (Zn/Sn)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a prominent manufacturer and supplier of high-purity zinc tin evaporation materials, as well as a broad range of other evaporation materials. We offer these materials in both powder and granule forms to meet diverse application needs. Customized forms are available upon request to suit specific requirements.

MSDS File

Zinc Tin Evaporation Materials Overview

Our zinc tin evaporation materials at Thin-Film Mat Engineering (TFM) are crafted from a precise alloy of zinc (Zn) and tin (Sn). These high-purity materials, boasting up to 99.9995% purity, are integral to achieving superior quality in deposition processes. At TFM, we adhere to stringent quality assurance protocols to ensure that our products consistently meet the highest standards of reliability and performance.

Applications of Zinc Tin Evaporation Materials

Zinc tin evaporation materials serve various critical functions in the following areas:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD), these materials help in forming high-quality thin films.
  • Optics: Utilized for applications such as wear protection, decorative coatings, and advanced displays, where durability and clarity are crucial.

Packaging and Handling

Our zinc tin evaporation materials are meticulously tagged and labeled for clear identification and quality control. We prioritize careful packaging to prevent damage during storage and transit, ensuring that the materials arrive in optimal condition.

Custom Solutions and Inquiries

Thin-Film Mat Engineering (TFM) offers zinc tin evaporation materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities can be requested to meet specific needs. Additionally, we provide a range of related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to request materials not listed, please contact us for more information.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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