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ST1008 Zinc Tin Oxide (ZTO) Sputtering Target, ZnO-SnO2

Chemical FormulaZnO-SnO2
Catalog No.ST1008
CAS Number12036-37-2
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Known for their exceptional purity, TFM provides Zinc Tin Oxide Sputtering Targets. With deep expertise in materials science, TFM is dedicated to delivering customized solutions and competitive pricing to meet the specific needs of nanotechnology and thin-film deposition applications.

MSDS File

Zinc Tin Oxide (ZTO) Sputtering Target Description

Zinc Tin Oxide (ZTO) Sputtering Targets are versatile materials used in thin film deposition processes. Comprising both zinc oxide and tin oxide, ZTO offers excellent electrical conductivity and optical transparency, making it ideal for applications in transparent conductive films, such as touchscreens, solar cells, and displays. Its notable features include high electron mobility, strong stability, and compatibility with a range of substrates. ZTO Sputtering Targets provide precise control over film thickness and composition, facilitating the production of high-performance electronic devices with improved functionality and durability.

Related Product: Zinc Sputtering Target, Tin Zinc Sputtering Target

Zinc Tin Oxide (ZTO) Sputtering Target Specifications

Compound FormulaZnO-SnO2
Molecular Weight232.087
AppearanceWhite Target
Melting Point (℃)>570
Density g/cm34.25
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Zinc Tin Oxide (ZTO) Sputtering Target Handling Notes

Indium bonding is recommended for Zinc Tin Oxide (ZTO) Sputtering Targets because of their inherent brittleness and low thermal conductivity, which can make them challenging for traditional sputtering methods. The material’s low thermal conductivity and susceptibility to thermal shock further emphasize the need for indium bonding to enhance performance and stability.

Zinc Tin Oxide (ZTO) Sputtering Target Application

Transparent Conductive Films: ZTO Sputtering Targets are used to deposit transparent conductive films, essential for touchscreen panels in smartphones, tablets, and other electronic devices.

Solar Cells: ZTO thin films are applied in the production of solar cells to boost their efficiency and longevity.

Displays: ZTO coatings are utilized in display technologies, including liquid crystal displays (LCDs), organic light-emitting diode (OLED) displays, and thin-film transistors (TFTs).

Smart Windows: ZTO films are integrated into smart window systems, where their conductivity can be adjusted to control light and heat transmission dynamically.

Thin-Film Transistors (TFTs): ZTO thin films function as active layers in TFTs, which are critical for flat-panel displays, sensors, and electronic circuits.

Flexible Electronics: ZTO materials are compatible with flexible substrates, making them ideal for applications in flexible electronics, such as wearable devices, flexible displays, and electronic textiles.

Zinc Tin Oxide (ZTO) Sputtering Target Packaging

Our Zinc Tin Oxide (ZTO) Sputtering Targets are meticulously managed during storage and transportation to ensure they maintain their quality and remain in optimal condition.

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TFM offers Zinc Tin Oxide (ZTO) Sputtering Targets in a range of forms, purities, and sizes. We specialize in high-purity physical vapor deposition (PVD) materials, ensuring optimal density and minimal average grain sizes. Our targets are designed for use in semiconductor applications, as well as in chemical vapor deposition (CVD) and physical vapor deposition (PVD) for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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