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ST0125 Zirconium Aluminum Sputtering Target, Zr/Al

Chemical Formula: Zr/Al
Catalog Number: ST0125
CAS Number: 7440-67-7 | 7429
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Aluminum Sputtering Target Description

The Zirconium Aluminum Sputtering Target from TFM is an alloy sputtering material composed of Zr and Al.

Zirconium

Zirconium, a chemical element, derives its name from the Persian word ‘zargun,’ which translates to ‘gold colored.’ Its existence was first documented in 1789 by H. Klaproth, while J. Berzelius later achieved and declared its isolation. Zirconium is represented by the chemical symbol “Zr” and holds the atomic number 40 in the periodic table. Positioned in Period 5 and Group 4, it belongs to the d-block elements. The atomic mass of zirconium is noted as 91.224(2) Dalton, with the numbers in parentheses indicating the uncertainty of this measurement.

Related Product: Zirconium (Zr) Sputtering Target

AluminumAluminium, often referred to as aluminum in some regions, is a chemical element that traces its etymology to the Latin word ‘alumen,’ meaning bitter salt. It was first recognized in 1825 by H.C. Ørsted, who not only identified but also isolated the element. Aluminium is denoted by the chemical symbol “Al” and carries an atomic number of 13 in the periodic table. It is positioned in Period 3 and Group 13, categorizing it within the p-block of elements. The atomic mass of aluminium is precisely recorded as 26.9815386(8) Dalton, with the figure in parentheses capturing the slight uncertainty of this measurement.

Related Product: Aluminium (Al) Sputtering Target

Zirconium Aluminum Sputtering Target Application

The Zirconium Aluminum Sputtering Target is utilized across various industries for thin film deposition. It plays a crucial role in the enhancement of semiconductor devices, displays, LEDs, and photovoltaic systems. Additionally, it is used in the decorative and functional coating of materials within the optical data storage sector. This sputtering target is also essential in the glass coating industry, including applications in automotive and architectural glass. Moreover, it supports technologies in optical communication and other related fields.

Zirconium Aluminum Sputtering Target Packing

Our Zirconium Aluminum Sputtering Targets are meticulously tagged and labeled externally to ensure easy identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the integrity of our products upon delivery.

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TFM offers Zirconium Aluminum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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