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ST0126 Zirconium Copper Sputtering Target, Zr/Cu

Chemical Formula: Zr/Cu
Catalog Number: ST0126
CAS Number: 7440-67-7 | 7440
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Copper  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Copper Sputtering Target Description

The Zirconium Copper Sputtering Target from TFM is an alloy sputtering material composed of Zr and Cu.

ZirconiumZirconium, named after the Persian word ‘zargun,’ which means ‘gold colored,’ was first identified in 1789 by H. Klaproth. The element was later isolated and announced by J. Berzelius. Represented by the chemical symbol “Zr,” zirconium has an atomic number of 40 and is situated in Period 5, Group 4 of the periodic table, within the d-block. Its relative atomic mass is 91.224(2) Dalton, with the number in parentheses indicating the uncertainty of the measurement.

Related Product: Zirconium (Zr) Sputtering Target

CopperCopper, a chemical element, gets its name from the Old English word “coper,” which is derived from the Latin term ‘Cyprium aes,’ meaning ‘metal from Cyprus.’ It has been in use since as early as 9000 BC, discovered by ancient civilizations in the Middle East. The chemical symbol for copper is “Cu,” and it has an atomic number of 29. Copper is located in Period 4, Group 11 of the periodic table, within the d-block. Its relative atomic mass is 63.546(3) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Copper (Cu) Sputtering Target

Zirconium Copper Sputtering Target Application

The Zirconium Copper Sputtering Target is utilized in a wide range of applications, including thin film deposition, decorative coatings, and semiconductor devices. It is also essential for display and LED technologies, photovoltaic devices, and functional coatings. Additionally, it finds use in the optical information storage industry, glass coating for automotive and architectural purposes, and optical communication systems, among other areas.

Zirconium Copper Sputtering Target Packing

Our Zirconium Copper Sputtering Targets are meticulously tagged and labeled externally to guarantee efficient identification and stringent quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Zirconium Copper Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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