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VD0666 Zirconium Titanium Evaporation Materials, Zr/Ti

Catalog No.Zr/Ti-VD
MaterialZirconium Titanium (Zr/Ti)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity zirconium-titanium evaporation materials, as well as a broad selection of other evaporation materials. Our zirconium-titanium materials are available in both powder and granule forms, with customization options to meet specific needs.

 

Zirconium Titanium Evaporation Materials Description

TFM offers high-purity zirconium-titanium alloy evaporation materials, which are essential for producing high-quality deposited films. Our zirconium-titanium materials, containing both Zr and Ti, are manufactured with purity levels up to 99.9995%. We use stringent quality assurance processes to ensure the reliability and excellence of our products.

Related Products: Zirconium Evaporation Materials, Titanium Evaporation Materials

Applications of Zirconium Titanium Evaporation Materials

Our zirconium-titanium evaporation materials are widely used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

We ensure that zirconium-titanium evaporation materials are carefully tagged and labeled for easy identification and quality control. Our packaging is designed to prevent any damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity zirconium-titanium evaporation materials, available in various forms including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about other products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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