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ST0128 Zirconium Tungsten Sputtering Target, Zr/W

Chemical Formula:Ā Zr/W
Catalog Number:Ā ST0128
CAS Number:Ā 7440-67-7 | 7440
Purity:Ā 99.5%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium TungstenĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Tungsten Sputtering Target Description

The Zirconium Tungsten Sputtering Target from TFM is an alloy sputtering material composed of Zr and W.

ZirconiumZirconium, whose name is derived from the Persian word ‘zargun’ meaning ‘gold colored,’ was first documented in 1789 by H. Klaproth. It was later successfully isolated and announced by J. Berzelius. Represented by the chemical symbol “Zr,” zirconium holds the atomic number 40 in the periodic table. It is located in Period 5, Group 4, within the d-block. The relative atomic mass of zirconium is 91.224(2) Dalton, with the number in parentheses indicating the measurement’s uncertainty.

Related Product:Ā Zirconium (Zr) Sputtering Target

TungstenTungsten, also known as wolfram (from its historical name wolframium), is a chemical element whose name originates from the Swedish words ā€˜tung sten,ā€™ meaning ‘heavy stone.’ First mentioned in 1781 by T. Bergman, tungsten was later isolated and announced by J. and F. Elhuyar. It is represented by the chemical symbol “W” and has an atomic number of 74. Tungsten is located in Period 6, Group 6 of the periodic table, within the d-block. Its relative atomic mass is 183.84(1) Dalton, with the number in parentheses indicating the uncertainty.

Related Product:Ā Tungsten (W) Sputtering Target

Zirconium Tungsten Sputtering Target Application

The Zirconium Tungsten Sputtering Target is utilized in various applications, including thin film deposition and decorative coatings. It is essential for the semiconductor industry, display technologies, LED and photovoltaic devices, and functional coatings. Additionally, it serves the optical information storage sector, the glass coating industryā€”such as for automotive and architectural glassā€”and optical communication systems, among other fields.

Zirconium Tungsten Sputtering TargetĀ Packing

Our Zirconium Tungsten Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care to prevent any damage during storage and transportation, maintaining the highest standards of product integrity upon delivery.

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TFM offers Zirconium Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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