Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

VD0667A ZnxCd1-xTe Pellet Evaporation Material

MSDS File
Material TypeZnxCd1-xTe
SymbolZnxCd1-xTe
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

 

ZnxCd1-xTe Pellet Evaporation Material

TFM offers high-quality ZnxCd1-xTe (Zinc Cadmium Telluride) pellet evaporation material, designed for thin-film deposition in advanced semiconductor and optoelectronic applications. The ZnxCd1-xTe alloy, which consists of zinc (Zn), cadmium (Cd), and tellurium (Te), is highly valued for its wide bandgap, excellent radiation detection properties, and high resistivity, making it ideal for detector technologies, infrared detectors, and solar cells.

The evaporation process using ZnxCd1-xTe pellets allows for precise control in the deposition of thin films with high purity and uniformity. These films are particularly used in the production of infrared detectors, X-ray detectors, and gamma-ray detectors, due to their high atomic number and outstanding energy resolution. ZnxCd1-xTe is also used in optoelectronic devices, where the tunable bandgap allows for customizable performance for specific light wavelength applications, such as photodetectors and laser diodes.

In addition, ZnxCd1-xTe films are used in solar energy devices, where their excellent optical properties and high electron mobility contribute to efficient energy conversion in thin-film solar cells. The material’s resistivity and structural stability make it suitable for a wide range of high-performance applications in semiconductors, imaging systems, and radiation-sensitive devices.

TFM provides customized ZnxCd1-xTe pellet evaporation materials, ensuring precise control over composition and purity to meet the specific demands of advanced thin-film deposition. These pellets are manufactured to ensure optimal evaporation performance, resulting in uniform and high-quality thin films for cutting-edge applications in infrared detection, solar energy, and optoelectronics.

The density of ZnxCd1-xTe pellet evaporation material typically ranges from 5.7 to 6.1 g/cm³, depending on the specific x value in the ZnxCd1-xTe alloy. This density range contributes to the material’s excellent thermal stability and mechanical strength, making it suitable for high-performance applications.

Our ZnxCd1-xTe pellet evaporation materials are manufactured to the highest standards, offering superior material quality, low impurity levels, and optimized evaporation characteristics. TFM’s ZnxCd1-xTe materials are perfect for advanced thin-film applications in high-tech industries, including electronics, medical imaging, and renewable energy.

The density of ZnxCd1-xTe pellet evaporation material is a key factor in its performance. With density typically ranging from 5.7 to 6.1 g/cm³, it ensures that the material maintains optimal structural integrity during deposition processes. This makes it suitable for high-tech applications, including detectors and solar energy devices.

The density of ZnxCd1-xTe pellet evaporation material plays a crucial role in ensuring uniform film formation during the evaporation process. By maintaining a density range of 5.7 to 6.1 g/cm³, TFM guarantees that the deposited films maintain high purity and uniform thickness, contributing to their superior optical and electronic properties.

The ZnxCd1-xTe pellet evaporation material‘s density is critical for applications that require precise control and performance reliability. TFM’s density-optimized ZnxCd1-xTe pellets are specifically designed to provide consistent and high-quality deposition in cutting-edge thin-film applications, from infrared sensors to solar power generation.

4o mini

Reviews

There are no reviews yet.

Be the first to review “VD0667A ZnxCd1-xTe Pellet Evaporation Material”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top