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ST0177 Molybdenum Oxide Sputtering Target, MoO3

Chemical Formula: MoO3
Catalog Number: ST0177
CAS Number: 1313-27-5
Purity: >99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Molybdenum Oxide (MoO)  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Molybdenum Oxide Sputtering Target (MoO₃) is a key oxide material used in advanced thin-film deposition processes, particularly where precise control of electronic structure, optical transparency, and work function is required. As a wide-bandgap transition metal oxide, MoO₃ plays a critical role in modern optoelectronic, semiconductor, and energy-related devices. Its ability to form uniform, stable oxide films makes it a preferred choice for research laboratories and industrial coating systems alike.

Detailed Description

MoO₃ sputtering targets are manufactured from high-purity molybdenum trioxide powder that is carefully processed through controlled pressing and sintering steps. This ensures high density, low porosity, and excellent compositional uniformity—factors that directly influence sputtering stability and thin-film consistency.

Compared with metallic molybdenum targets, MoO₃ targets enable direct deposition of oxide films without the complexity of reactive sputtering. This simplifies process control, reduces oxygen flow fluctuations, and improves repeatability in both RF and DC sputtering systems (typically RF is preferred due to the insulating nature of MoO₃).

From an application standpoint, MoO₃ is valued for its high work function, strong electron-accepting behavior, and excellent optical transparency in the visible range. These characteristics make MoO₃ films especially suitable for interface layers, charge transport layers, and functional oxide coatings where electronic alignment and film purity are critical.

Custom geometries—including round, rectangular, and bonded targets—are available to match different sputtering cathodes and power densities.

Applications

Molybdenum Oxide sputtering targets are widely used in the following fields:

  • Organic electronics: Hole injection and hole transport layers in OLEDs and organic photovoltaics (OPVs)

  • Semiconductor devices: Interface and buffer layers in thin-film transistors (TFTs) and sensors

  • Electrochromic devices: Smart windows and optical modulation coatings

  • Energy technologies: Functional layers in lithium-ion batteries and supercapacitors

  • Optical coatings: Transparent oxide films with tailored refractive properties

  • Research & development: Thin-film studies involving transition metal oxides and surface engineering

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionMoO₃ (Molybdenum Trioxide)Determines electronic and optical properties
Purity99.9% – 99.99%Reduces contamination and improves film performance
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mm (typical)Affects target lifetime and sputtering rate
Density≥ 95% of theoreticalEnsures stable sputtering and uniform erosion
BondingIndium / Elastomer / DirectEnhances thermal contact and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
MoO₃High work function, excellent transparencyOLEDs, OPVs, interface layers
WO₃Strong electrochromic responseSmart windows, displays
V₂O₅High ionic conductivityBatteries, sensors
Metallic MoHigh conductivityBarrier layers, electrodes

FAQ

QuestionAnswer
Can MoO₃ sputtering targets be customized?Yes, purity, size, thickness, and bonding options can be tailored.
Is RF sputtering required for MoO₃?MoO₃ is an insulating oxide, so RF sputtering is generally recommended.
How is the target packaged?Vacuum-sealed with protective cushioning to prevent moisture uptake and damage.
Can MoO₃ replace reactive sputtering processes?In many cases, yes—using an oxide target simplifies process control and improves repeatability.

Packaging

Our Molybdenum Oxide Sputtering Targets (MoO₃) are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is carefully vacuum-sealed and protected with reinforced cushioning to prevent contamination, moisture exposure, or mechanical damage during storage and transportation, ensuring arrival in optimal condition.

Conclusion

Molybdenum Oxide Sputtering Target (MoO₃) offers a reliable, process-stable solution for depositing high-quality oxide thin films with well-defined electronic and optical properties. With flexible customization options and consistent manufacturing quality, it is well-suited for both cutting-edge research and scalable industrial production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Related Product: Molybdenum Sputtering TargetOxygen

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MoO₃ Target Ø1/16″ target + Ø1/16″ bonding

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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