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ST0214 Niobium Nitride Sputtering Target, NbN

Chemical Formula: NbN
Catalog Number: ST0214
CAS Number: 24621-21-4
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Nitride Sputtering Target Description

Niobium Nitride sputtering target from TFM is a nitride ceramic sputtering material with the chemical formula NbN. This material is known for its unique properties and applications in various high-performance industries, including electronics, superconductors, and optical coatings. Niobium Nitride sputtering targets are utilized in thin film deposition processes to create coatings that enhance the electrical, optical, and mechanical properties of surfaces.

niobium

Niobium is a silver-colored metal typically found alongside tantalum. These two elements are often separated through fractional crystallization of their respective fluoro-complexes. Niobium has an abundance of approximately 20 parts per million (ppm) in the Earth’s crust. In its pure form, niobium is highly reactive, particularly when exposed to air, where it forms a stable oxide layer that significantly enhances its corrosion resistance. This metal also reacts with various non-metals at elevated temperatures, making it versatile for different industrial applications, including its use in superconducting materials, alloys, and specialized coatings.

Related Product: Niobium Sputtering Target

NitrogenNitrogen is a chemical element with the symbol “N” and atomic number 7. It derives its name from the Greek words ‘nitron’ and ‘genes,’ meaning nitre-forming. Nitrogen was first identified and isolated by Daniel Rutherford in 1772. It belongs to the p-block of the periodic table, situated in Period 2 and Group 15. The relative atomic mass of nitrogen is approximately 14.0067, with the number in brackets indicating the measurement’s uncertainty. Nitrogen is a fundamental component of the atmosphere, constituting around 78% of the Earth’s air by volume, and is essential for all known forms of life.

Niobium Nitride Sputtering Target Application

The niobium nitride (NbN) sputtering target is widely used in various applications, including thin film deposition for decoration, semiconductor devices, displays, LEDs, and photovoltaic devices. It is also utilized in creating functional coatings, which are essential in industries such as optical information storage, glass coating for automotive and architectural uses, and optical communication systems. This material’s properties make it valuable for enhancing the durability and functionality of coated surfaces across these diverse applications.

Niobium Nitride Sputtering Target Packaging

Our niobium nitride sputtering target is meticulously tagged and labeled externally for easy identification and stringent quality control. We take exceptional care in handling and packaging these targets to prevent any damage during storage or transportation, ensuring that the product arrives in pristine condition and maintains its quality throughout its use.

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TFM offers Niobium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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