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ST0976 Aluminum Manganese Sputtering Target, Al/Mn

Chemical FormulaAl/Mn
Catalog No.ST0976
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Renowned for their exceptional purity and competitive pricing, Aluminum-Manganese sputtering targets from TFM exemplify excellence. Leveraging our extensive expertise in materials science, we guarantee superior performance and reliability through meticulous craftsmanship in the production of these targets.

MSDS File

Aluminum Manganese Sputtering Target Description

Aluminum-Manganese sputtering targets are distinguished by their exceptional properties, which make them highly effective for thin film deposition applications. These targets are renowned for their excellent purity, ensuring reliable and consistent results in thin film preparation. They also offer strong electrical properties, making them particularly suitable for use in the semiconductor industry. The unique alloy combination imparts superior chemical stability, allowing these targets to maintain performance and stability throughout the thin film deposition process. These attributes make Aluminum-Manganese sputtering targets widely utilized across high-tech industries, supporting the advancement of cutting-edge technologies and various industrial applications.

Related Product: Manganese Sputtering Target, Manganese Oxide Sputtering Target

Aluminum Manganese Sputtering Target Specifications

Compound FormulaAl/Mn
AppearanceSilver Metallic Target
Density2.72g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Aluminum Manganese Sputtering Target Handling Notes

Indium bonding is recommended for Aluminum-Manganese sputtering targets due to their inherent characteristics, such as brittleness and low thermal conductivity, which can impact sputtering performance. The low thermal conductivity and susceptibility to thermal shock of this material make indium bonding a suitable choice to enhance its stability and effectiveness during the sputtering process.

Aluminum Manganese Sputtering Target Application

Semiconductor Industry: Aluminum-Manganese sputtering targets are highly valued in the semiconductor industry for their excellent electrical properties. They are used in thin film deposition to create high-performance films essential for electronic components and integrated circuits.

Optical Coatings: These targets are crucial in the production of optical coatings, helping to create thin films with specific optical properties for a wide range of optical devices and applications, including lenses and filters.

Magnetic Sensors: Thin films produced from Aluminum-Manganese targets are used in manufacturing magnetic sensors and devices, playing a key role in advancing sensing technologies.

Electronics: In electronic device manufacturing, these targets are employed to produce thin films that enhance the performance and stability of electronic components, supporting various electronic applications.

Aluminum Manganese Sputtering Target Packaging

Our Aluminum-Manganese sputtering targets are meticulously handled throughout storage and transportation to ensure they retain their quality and arrive in optimal condition.

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TFM’s Aluminum-Manganese sputtering targets are offered in a variety of forms, purities, and sizes. We focus on producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes. These targets are ideal for semiconductor applications, as well as for chemical vapor deposition (CVD) and PVD in display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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