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ST1013 Barium Strontium Titanate Sputtering Target, BaxSr(1-x)TiO3

Chemical FormulaBaxSr(1-x)TiO3
Catalog No.ST1013
CAS Number12430-73-8
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

The Barium Strontium Titanate Sputtering Target from TFM is used in thin film deposition processes to create advanced electronic devices with tunable dielectric properties, suitable for telecommunications and electronics applications.

MSDS File

Barium Strontium Titanate Sputtering Target Description

Barium Strontium Titanate (BST) Sputtering Target is a critical material for thin film deposition, composed of barium, strontium, and titanium oxides. Known for its tunable dielectric properties, BST is essential in electronics and telecommunications applications. The high purity and precise composition of BST ensure uniform film deposition, facilitating the production of advanced electronic devices such as tunable capacitors and microwave components. Its versatility and reliability make BST indispensable in the semiconductor industry, supporting the development of high-performance electronic components with enhanced functionality.

Related Product: Barium Zirconate Sputtering Target

Barium Strontium Titanate Sputtering Target Specifications

Compound FormulaBaxSr(1-x)TiO3
Molecular Weight336.81
AppearanceBrown Target
Melting Point1625°C
Density~6 g/cm³
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Barium Strontium Titanate Sputtering Target Handling Notes

Indium bonding is recommended for Barium Strontium Titanate (BST) Sputtering Targets due to their inherent brittleness and low thermal conductivity. These characteristics can make BST targets more susceptible to thermal shock during sputtering processes. Indium bonding helps mitigate these issues, ensuring better thermal and mechanical stability, which enhances the overall performance and reliability of the sputtering process.

Barium Strontium Titanate Sputtering Target Application

  • Electronics: Essential for producing tunable capacitors, ferroelectric memories, and piezoelectric devices, BST targets enable advanced electronic systems with enhanced performance.
  • Telecommunications: Used in fabricating tunable microwave devices such as phase shifters and filters, BST targets facilitate frequency agility and signal modulation for communication systems.
  • Sensors: Applied in manufacturing sensors for pressure, temperature, and gas sensing due to their tunable dielectric properties and high sensitivity.
  • Energy Storage: Key in developing energy storage devices like supercapacitors, where tunable dielectric properties improve charge storage and discharge efficiency.

Barium Strontium Titanate Sputtering Target Packaging

Our Barium Strontium Titanate Sputtering Target is meticulously handled during storage and transportation to maintain the highest quality and ensure it arrives in optimal condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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